SMART Group - Surface Mount and Related Technologies

Latest Survey

When encountering solder paste release issues when stencil printing fine pad features, what would be your approach?

Reduce stencil thickness & maintain aperture size
Maintain stencil thickness & increase aperture size
Use solder paste with reduced particle size i.e increased type no.
Use alternative solder deposition techniques such as jet printing
Not encountered these problems

The Latest News from SMART Group