SMART Group - Surface Mount and Related Technologies

QFN/LGA & Bottom Mounted Termination Process Defects – Causes & Cures

When: Back to Calendar September 14, 2017 @ 9:30 am - 4:00 pm
Where: Henkel
Hemel Hempstead
Contact: Keith Bryant
00 44 7946133531

QFN/LGA & Bottom Mounted Termination Process Defects – Causes & Cures
Thursday 14th September starting at 9.30am, coffee at 9.00am and finishing at 4.00pm to be held at Henkel, Hemel Hempstead

Table Top Exhibition space will be limited at this event, book you place early to avoid disappointment Click Here

The workshop will consider design, process and materials to reduce or eliminate common issues seen on QFN/LGA & Bottom Mounted Termination Components. These packages are being used in the most demanding environments and their use will increase with larger packages and increasing process issues


Defect issues being addressed in the workshop will include:

Solder joint reliability improvements
Successful cleaning under parts
Void formation and elimination
Reliability issue with conformal coating
Improvements in side solder fillet formation

We will be arranging some hands-on soldering demonstrations with QFN/LGA & Bottom Mounted Components to best illustrate improvements in soldering yields. The SMART Group event is ideal for design, process and quality engineers. It will also benefit component and PCB suppliers

Each delegate will receive a copy of all the slides presented plus a set of SMART Group QFN/LGA & Bottom Mounted Termination Process Defects & Inspection Posters

To book your workshop place or for further information Click Here