Conductive Adhesives for Electronics Packaging By Johan Liu Publisher: Electrochemical Publications 425 pages Review by Bob Willis

Will conductive adhesives replace solders? Probably not, but they do have their place in many modern electronics applications. Each chapter of this handbook provides a good mixture of illustrations and real examples showing joint structures. The text covers the materials and compares many different adhesive types and conductive filler types. Comparisons are given on the curing mechanisms and the issues related to cure and under-cure.

The text provides insight into the advantages and disadvantages of adhesive use, and also explains why and how this technology is misunderstood. Design-specific issues are discussed and failure modes are explained in various sections of the text.

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