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Book
Reviews |
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Chip Scale Package Mc Graw Hill
By John Lau and Ricky Lee
Published by McGraw Hill
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Yet another book from
the pen of John Lau ably supported by Ricky Lee. I have reviewed a number
of books from John Lau in the past and each has in my opinion been of
great value to the industry. The partnership with Ricky based in Hong
Kong provides an opportunity for a World Wide prospective. Its been a
number of years since this reviewer worked at the Hong Kong University,
Ricky is a very helpful and energetic engineer which comes across in the
text.
Just like John's book on BGA Technology this CSP reference is very timely
as the focus of the industry is on this next step in surface mount technology.
The CSP roller coaster is in part being driven by the problems still associated
with the problems of KGD Known Good Die. CSP is a relatively simple technology
from a assembly point of view and that is the only criticism of this new
book.
Where is the chapter on printed board assembly covering printing, placement,
reflow, rework and inspection ? I feel that this text would have been
that much better for a short chapter on assembly and soldering. It was
a key feature to many process engineers with The BGA Technology Handbook.
Apart from this minor criticism the book runs for just under 600 pages
with each of the 36 chapters well illustrated for easy reference. Most
of the chapters cover the different CSP options each broken down into
sections covering design, materials, fabrication, reliability and advantages
of the different CSP styles.
It is worth reading to be ready for what our friends in the design departments
have in store for us in manufacture.
If you know of any new good titles let us know
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