Currently one of the most up to date text books on printed board technology and very well worth the investment. Overall the book is well illustrated but selected chapters could have done with more diagrams and photographs. This is a critasiam often leveled at text books in our industry, its not that difficult to obtain useful material from a wide range of sources.
All the areas in a book of this type are covered, a whole section is devoted to the concepts and types of microvia technology used in the industry. The cost implications and design requirements are defined along with the process steps. There could have been a little more on the design issues and some of the problems they can cause during assembly would have been beneficial to the reader. There are a few application examples of microvia most of which relates to telecom and high end consumer electronics.
The use of alternative substrates like ceramic and flex are discussed along with buildup technology which has become very popular, with Japan currently leading the world. This position was emphasised in a recent Mission to Japan lead by the PCIF. It has also been a subject dealt with by the IPC over the last couple of years. Issues relating to the environment are considered specifically where it relates to printed board manufacture.
This a very worthwhile text book and produced as one of the New McGraw Hill Professional Engineering series.
Back to Book Review Index
