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JTR: English-language Resource from Japan Mfg Sector

After very positive feedback from industry associations in Taiwan as well as sales being kicked off by the U.S., five titles added round out this report service as the first of its kind for Japan.

“Although we are slated to feature reports from Japan’s Electronics and Manufacturing sector as well, we have initiated our Japan Technology Report (JTR) service with hot topics from Japan’s Automotive sector to kick things off,” states Hiroyuki Ogihara, assistant Group Publisher, Electronics/Mechanical Group.

“In this era of constant change, growth, and competition, we felt an English-language supply of tech info from Japanese manufacturers would be a welcome tool and resource for think-tanks, industry players, consultants and Universities with strong engineering departments. We have 200 dedicated technical writers with un-equaled access to decision makers and RD heads at Japan’s most cutting edge firms. Many of our writers know industry leaders directly so they are able to achieve truly insightful and detailed reports on technology and industry developments, “he adds.

“Japan Technology Report” is a for-purchase service produced by Nikkei BP’s team of highly specialized expert technical writers who provide English-language reports stemming from direct, one-on-one interviews about the technology being born and developed in domestic and international research centers and factories.

Tailored to the needs of companies, “Japan Technology Report” sheds light on information that, to date, was available primarily via academic conferences, seminars or publications for highly specialized and limited audiences.

Titles available as of today are:

1. Inside Honda’s State-of-the-Art Yorii Plant in Japan; To Boost Global Cost Competitiveness 
This cutting-edge plant produces 1050 new FIT automobiles per day with a tact time compressed to less than 50 seconds.

2. Japanese Manufacturers Hot on the Tail of US/European Firms in Self-Driving Cars; Toyota, Nissan, and Honda Enter the Fray 
Achievements behind the three major players’ effort to get self-driving cars on public roads by 2020.

3. Mitsubishi Motors Development Engineers Reveal Their PHEV Problems 
In-depth examination of roots and solutions to issues with the “Outlander PHEV” battery and a look into other reported software defects.

4. New Engines Aiming for 60% Thermal Efficiency; Japanese Automobile Manufacturers Rise to the Post-HEV Challenge 
Thermal efficiency is only increasing. 40% over the last century, expected 50% efficiency in the next decade and sights are set on 60% via new engine trends outlined here.

5. Nissan Puts Steer-by-Wire on the Road; An In-Depth Look at the Technology 
The Skyline hybrid features steer-by-wire achieved with a ground-breaking resistance feedback motor and other high precision technology developed by Nissan engineers.

Article source: http://www.pcb007.com/pages/zone.cgi?a=101943

Taiwan Export Growth Reflects Stronger Global Demand


Article source: http://www.pcb007.com/pages/zone.cgi?a=101980

TI Intros Internet on Chip for IoT Applications

Texas Instruments (TI) has introduced its new SimpleLink™ Wi-Fi® CC3100 and CC3200 platforms for Internet of Things (IoT) applications. The SimpleLink Wi-Fi family is the first in a series of new easy, low power SimpleLink wireless connectivity solutions for the IoT. This new Internet-on-a-chip™ family allows customers to easily add embedded Wi-Fi and Internet to a wide-range of home, industrial, and consumer electronics through features including:

  • The industry’s lowest power consumption for battery operated devices with a low power radio and advanced low power modes.
  • Flexibility to use any microcontroller (MCU) with the CC3100 solution or leverage the CC3200‘s integrated programmable ARM® Cortex®-M4 MCU, allowing customers to add their own code.
  • Easy development for the IoT with quick connection, cloud support and on-chip Wi-Fi, Internet and robust security protocols, requiring no prior Wi-Fi experience to get a product connected. 
  • The ability to simply and securely connect their devices to Wi-Fi using a phone or tablet app or a web browser with multiple provisioning options including SmartConfig™ Technology, WPS and AP mode.

With a QFN package and fully integrated RF and analog, the CC3100 and CC3200 allow developers to create a low cost, compact and easy to use system by placing the device directly on a PCB. The SimpleLink Wi-Fi family comes with cloud connectivity support through TI’s IoT cloud ecosystem members. TI also provides various kits and software tools, a certified TI module (coming soon), reference designs, sample applications, development documentation, and TI E2E™ community support.

Building on its MCU ecosystem of low-cost LaunchPad evaluation kits and BoosterPack plug-in modules, TI provides developers an easy way to design and evaluate Wi-Fi and Internet applications:

  • Get started using TI’s SimpleLink Wi-Fi CC3200 solution with the first wireless connectivity LaunchPad evaluation kit.
  • The SimpleLink Wi-Fi CC3100 BoosterPack plus the Advanced Emulation BoosterPack allows customers to connect to any MCU, including the ultra-low power MSP430™ LaunchPad.
  • If customers have not selected an MCU or want to get started quickly, they can begin software development with a PC and the CC3100 BoosterPack plus the Advanced Emulation BoosterPack using SimpleLink Studio.

For more information on the features and benefits of the SimpleLink Wi-Fi CC3100 and CC3200 platforms, read this blog post.

Pricing and availability:

  • SimpleLink Wi-Fi CC3100 and CC3200 solutions are available now through TI eStore and TI authorized distributors:
    • CC3200 LaunchPad is available for $29.99
    • CC3100 BoosterPack +  CC31XXEMUBOOST + MSP-EXP430F5529LP bundle is available for $49.99
    • CC3100BOOST + CC31XXEMUBOOST bundle is available for $36.99
  • CC3100 and CC3200 production units will be available in July and will be part of TI’s sample program.
    • CC3100 –$6.70 per 1,000 units
    • CC3200 –Starting at $7.99 per 1,000 units
  • CC3100 and CC3200 modules will be available in 3Q

TI’s SimpleLink Wireless Connectivity Portfolio

TI’s SimpleLink portfolio of low power wireless connectivity solutions–wireless MCUs, wireless network processors (WNPs), RF transceivers, and range extenders for the broad embedded market–makes it easier to develop and connect anything to the Internet of Things (IoT). Spanning over 14 standards and technologies including Wi-Fi®, Bluetooth®, Bluetooth low energy, ZigBee®, Sub-1 GHz, 6LoWPAN and more, SimpleLink products help manufacturers add wireless connectivity to anything, to any design, for anyone. For more information, visit www.ti.com/simplelink.

About Texas Instruments

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.

Article source: http://www.pcb007.com/pages/zone.cgi?a=102072