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Intel CEO to Lead SIA as Chairman

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that the SIA board of directors has elected Brian Krzanich, CEO of Intel, as its 2015 chairman and Dr. Necip Sayiner, president, CEO and director of Intersil, as its 2015 vice chairman.

“We are excited to welcome Brian Krzanich as SIA’s 2015 chairman,” said Brian Toohey, SIA president and CEO. “His exceptional understanding of semiconductor issues and extensive industry experience make him uniquely qualified to help tackle our industry’s challenges and lead us into the future. We appreciate his many achievements and look forward to his leadership in 2015 as SIA chairman.”

Krzanich became the CEO of Intel in May 2013. He has progressed through a series of technical and leadership roles at Intel, most recently serving as the COO since January 2012. As COO, his responsibilities included leading an organization of more than 50,000 employees spanning Intel’s Technology and Manufacturing Group, Intel Custom Foundry, supply chain operations, the NAND Solutions group, human resources, information technology and Intel’s China strategy. Prior to becoming COO, Krzanich held senior leadership positions within Intel’s manufacturing organization. Krzanich began his career at Intel in 1982 in New Mexico as a process engineer.

“On the cusp of innovations such as the Internet of Things, wearable devices and smart cities, the U.S. semiconductor industry is poised for growth,” said Krzanich. “I look forward to collaborating with colleagues and policymakers to ensure that our industry reaches its full potential, continues to create jobs and keeps America at the forefront of technological advancement.”

Dr. Sayiner joined Intersil as president, CEO and director in March 2013. Prior to joining Intersil, he served as president, CEO and director of Silicon Laboratories from September 2005 to April 2012. Previously, Sayiner held various leadership positions at Agere Systems Inc., which included Executive Vice President and General Manager, Enterprise and Networking Division from August 2004 to September 2005; and Vice President and General Manager, Networking ICs Division from March 2002 to August 2004.

“Necip Sayiner has extensive industry experience and a strong technical background,” Toohey said. “His skills and leadership will be a tremendous asset to our association as we work to enact pro-innovation policies and build a stronger semiconductor industry in the U.S. We welcome him as 2015 SIA vice chairman.”

“I’m pleased to be supporting the SIA as vice chairman and helping to drive awareness of the importance of the semiconductor industry to our nation’s economic health,” said Sayiner. “Now more than ever, it is vital that we fight for government policies that promote growth and competitiveness.”

Article source: http://www.pcb007.com/pages/zone.cgi?a=104879

Future Lab-on-Chip Applications


Article source: http://www.pcb007.com/pages/zone.cgi?a=104910

Resolution of Key Challenges in IoT

The influx of wireless technologies and intelligent devices has resulted in the rapid evolution of theInternet of Things (IoT), a disruptive cross industry force expected to transform the manufacturing value chain into a state of hyper-connectivity. While it is only a matter of time before end users see the compelling benefits of real-time data collection and in-depth analysis of multiple process variables from diverse distributed assets, several roadblocks remain to enforce high-level business continuity.

New analysis from Frost Sullivan, Internet of Things (IoT)—Challenges and Impediments, finds that improving the speed and reliability of communication, enforcing a single standard across the enterprise, maintaining a robust security platform and managing high volume datasets are paramount to the success of the highly dynamic IoT landscape.

For complimentary access to more information on this research, visit http://bit.ly/1zyTljI.

“Security, particularly for critical infrastructure, is a key concern for end users owing to the number of attack points and potential magnitude of impact,” said Frost Sullivan Industrial Automation and Process Control Senior Research Analyst Rahul Vijayaraghavan. “As the IoT market moves towards semi- and fully-autonomous control networks, end users will have limited awareness and control in the event of targeted attacks, heightening the risk of sudden disruptions.”

While IoT provides benefits like responsiveness, collaboration, and visibility, there remain concerns surrounding management of high volume data traffic from multiple connected assets. End users must decide what mission-critical data (safety, financial, and operational) to manage in-house and what data should be progressively farmed out to service-platform providers. 

Additionally, to derive value from the data amassed, development of extensible, industry-specific platforms that offer actionable, real-time insights to improve operational productivity should be a focal point for solution providers.

“As data becomes the currency of the future, vendors must further invest in meeting critical end user data storage, management, analytics and ownership requirements,” noted Rahul. “The ability to establish robust strategic partnerships with IoT ecosystem value chain participants will determine if solution providers can sustain growth in the fast-evolving IoT domain.”

The report is a Market Insight that is part of the Industrial Automation Process Control Growth Partnership Service program. This Insight provides value chain participants in the IoT ecosystem an overview of the key business drivers fueling IoT adoption, applications of IoT across the manufacturing value chain, and a detailed analysis of critical concerns and road blocks.

About Frost Sullivan

Frost Sullivan, the Growth Partnership Company, works in collaboration with clients to leverage visionary innovation that addresses the global challenges and related growth opportunities that will make or break today’s market participants.

Our “Growth Partnership” supports clients by addressing these opportunities and incorporating two key elements driving visionary innovation: The Integrated Value Proposition and The Partnership Infrastructure.

Article source: http://www.pcb007.com/pages/zone.cgi?a=104750