SMART Events

SMART LEADOUT Update at Ireland Workshop

Over 60 engineers attended the final lead-free event of the year organised by SMART Group Ireland. Held in the Cork it proved to be a popular location for the event which focused on how the Group is supporting the Irish industries transaction to a lead-free manufacturing. The table top exhibition was well supported with many of the industries well know suppliers and distributors. Each of which were able to illustrate there own lead-free expertise. Discussion focused on the European funded LEADOUT project, SMART Irelands RoHS Mentor Programme and of course the main workshop.

Many of the results presented were based on practical lead-free trials conducted by members of the Group during the last couple of years. They are featured in the recently released "Lead-Free Experience Report". The 100 page colour report covers testing on components, printed boards, stencils, paste, reflow and circuit board reliability. The report contains many examples of joints, sections and x-ray images and is FREE to download here

Moss Dore introduced the "RoHS Mentor Programme" to the delegates. The aim of the programme is to provide SMART Group Ireland Members with information and assistance on Lead Free Soldering and RoHS Compliance. Companies in Northern Ireland and the Republic of Ireland that are MEMBERS of SMART Group Ireland can avail of this service currently bookings are restricted to the first 20 Member Applications. The programme offers a selection of training modules and consultancy support solutions researched extensively by the RoHS Prorgramme Facilitator.

Consultancy Solutions Include:

Alloy Selection, Solder Paste Considerations, Stencil Printing, Placement Considerations, Reflow Oven Validation Wave Soldering Systems Validation, Inspection and Workmanship Standards. Further details are available at www.leadfree.ie

Bob Willis was the main speaker of the day and presented the five hour workshop and answered all the questions in the final question session of the day. The best questions of the day were awarded a SMART Group interactive Lead-Free Training CD-ROM. SMART Ireland also presented a special prize (Apple IPod) to one lucky delegate for completing the Group's survey.

Lead-free assembly does have an impact on the design, manufacture and the potential reliability of printed board assemblies. Although the fundamental processes do not change, process parameters do change and there are process issues that are coming to light and do affect yields. This event provided a practical insight into the inspection criteria, changes to process conditions and how to monitor the process to obtain the highest yields. The session also illustrate the potential problems at each stage of manufacture and how to avoid them and where necessary changes to IPC610 D criteria will be required. Monitoring solderability of boards and components in production with simple tests were illustrated by Bob using techniques that any engineers could undertake.

There has been concern over the possible failure of small through holes during lead-free assembly. During trails on boards containing a via hole test pattern which featured 60 0.2mm (0.008") holes there were no failures found even after multiple soldering operations. Boards were exposed to multiple reflow, wave, rework and thermal shock exposures. Boards tested featured both conventional 140degC and high temperature laminate rated at 170degC laminate. Bob stated that in most cases standard FR4 will be compatible with lead-free manufacture provided the quality of PCB manufacture is maintained. Most failure modes seen so far has been poor quality circuit manufacture. The guidance on boards and materials has also been featured in a recent IPC report after two years of testing.

Solderability of different surface finishes was discussed during the workshop and Bob outlined the testing results that have been gathered over the last three years using the solder paste dot pattern. The results showed the order of wetting performance one each process stage through multiple reflow cycles. The results are included in this report

Inspection and quality control requirements were defined to monitor the process and understand what will be different in a lead-free environment. Lead-free solder joints can look different, there are new cosmetic defects which need to be understood also new equipment parameters monitored in production. Bob was able to back up many of his statements with macro video clips showing lead-free manufacture, failure modes and the joint formation.

Keep up to date on all SMART Group activities planed for Ireland during 2006 on this website. For information on LEADOUT visit www.leadoutproject.com

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