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SEMINAR ON LEAD-FREE ASSEMBLY AND SOLDERING - BRITISH EMBASSY JAPAN

19th February 2001

The seminar was given by members of The SMART Groups Lead-Free Mission to Japan to over 70 engineers and managers. Each presentation introduced the members company or organisation before covering the activities being undertaken to eliminate lead in the assembly and soldering processes in Europe


The Lead Free Mission outside the British Embassy in Tokyo, Japan

Each speaker gave a presentation of approximately 20 min with opportunities for questions after each speaker and a final open discussion:-

Bob Willis
The SMART Group Technical Director
An introduction was given on The SMART Group, the Missions sponsoring body, its aims and the reason for its involvement in Lead-Free assembly. Bob Willis also cover the creation of the "Interactive Lead-Free Assembly and Soldering Cookbook CD-ROM" a joint project with The National Physical Laboratory.

Dr Malcolm Warwick
Loctite/Multicore
A brief introduction was given on the company's involvement in lead-free assembly over the last 10 years prior to outlining some of the work, which has been conducted as part of collaborative projects in Europe.

Dr Chris Hunt
National Physical Laboratory
Dr Hunt introduced the work of the NPL and discuses the range of projects, which are currently being undertaken by his team. Projects include solder joint reliability, solderability and the effect of nitrogen, visual and AOI inspection, thermal profiling and rework. The NPL work is targeted to develop test methods and codes of practice in these areas.

Nick Jolly
Department of Trade and Industry
Nick Jolly outlined the current or pending legislation in Europe and indicate where it will have an impact on the user and supplier of electronic products. Nick received most of the questions during the open debate.

Phil Fulker
Invicta Engineering Limited
Phil Fulker examined the changes, which may be necessary when designing and specifying capital equipment for use during lead-free soldering. He covered both reflow and wave soldering process equipment and the need for compatibility with future materials.

Robert Horsley
Celestica Limited
Robert introduced the role of Celestica as a contract manufacture in a global market place before outlining customer demands for lead-free process introduction. He also illustrate how the demand for lead-free from different customers and for different products could lead to groups of production lines using different lead-free alloys, processes and inventory control.

For copies of all the papers presented on CD-ROM contact Tony Gordon on info@smartgroup.org. The CD will be available with the final report of the Mission at Nepcon Electronics, Birmingham 3-5 April

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