SMART Events

The seminar also featured the launch of the "SMART Group 0201 Charity Report" and a full session of technical presentations on 0201 chip component assembly. Two copies of the report were sold within a couple of days of its launch. One copy was sold at the seminar to Steve Woods of Total Interconnection Solutions. Steve is pictured below with a copy of the report beside Angus Westwater of ROHM, one of the report's authors.

For further details on The SMART Group 0201 Charity Report click here

For details on The SMART Group Lead Free Mission to Japan Report click here

The seminar was opened by Mike Judd, SMART Group PR Director who welcomed everyone to the day and explained the basic format of the event. Over 60 engineers attended the seminar with a tabletop exhibition which included Nepcon Electronics, REM, Parkheath/PDR and Planer. Mike then handed over to Simon Hawkins, Chairman of The SMART Group Technical Committee.

Lead-Free Speakers at The SMART Group annual seminar

The first section of the seminar was devoted to Lead-Free Updates with short presentations being given by regular speakers at the annual event before the open debate took place. The speakers included:

Kay Nimmo
Brian Richards
Nick Jolly
Malcolm Warwick
Chris Hunt

Copies of presentations are available to download from the Members Area of the website.

Authors of The SMART Group 0201 Design and Assembly Report at its launch. The picture features, from left to right, Malcolm Warwick, Angus Westwater, Simon Hawkins, Peter Grundy, Bruce Seaton and finally Bob Willis as team captain.

The main section of the day was devoted to the assembly and soldering of 0201 chip components which featured presentations by:

Angus Westwater
Malcolm Warwick
Bruce Seaton
Peter Grundy
Simon Hawkins
Bob Willis

Copies of 0201 presentations are available to download from the Members Area of the website.

Each of the speakers has been responsible for producing The SMART Group 0201 Assembly and Soldering Report. The report was launched at the seminar with all the profits of the report going to the Red Cross September 11th Appeal. The presentations covered each of the key topics in the design and assembly of 0201 and a good coverage on the general trends on component miniaturisation. Inevitably as passive resistors and capacitors decrease in size so do the active parts.

Delegates during The SMART Group seminar

The seminar was a great success with a good technical content plus a very nice mix of topics centred around 0201 chip components and lead- free technology.

For further information on The SMART Group 0201 Assembly and Soldering Report click here