SMART Events

Nepcon Process Technology Seminars

Nepcon Electronics 11-12th May

The seminar papers presented at the Nepcon 2005 are available to download from the following links

• IPC610D – International Soldering Standard Update - Barry Morris, ART
• PCB Design and Layout Changes for Lead-Free Production - Bob Willis
• Moisture Sensitive Devices MSDs – A Real Production Issue - Chris Ward, Almit
• How to Comply with the RoHS Directive Dr. Paul Goodman & Dr. Chris Robertson ER
• Small, Buried and Blind Via PCB Reliability - Dennis Price, Merlin Circuit Technology
• Key Trends and Challenges in Automated Test: Virtual Instrumentation from Design to Manufacturing - Ian Bell National Instruments
• Making Pin In Hole Reflow Work in a Lead-Free Process - Jürgen Hahn-Barth, Phoenix Contact
• Auditing Facilities for ESD Compliance - Jeremy Smallwood
• 0201 & 01005 Design and Assembly Issues - Peter Grundy, PG Engineering
• Measurement and Identification of Lead-Free Products - Sue Knight EADS ASTRIUM & SMART Group Technical Committee
• "LEADOUT" The Elimination of Lead in Manufacture - Simon Masson, TWI
• Identification and Labelling for Lead-Free Products - Tom Perrett, Tin Technology
• Chris Hunt NPL

Keep up to date with other events at www.smartgroup.org/showdiary.asp