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The Nepcon Process Technology Presentations where organised by the SMART Group Technical Committee and sponsored by Electronics Manufacture and Test magazine. See what you missed and why it should be in your diary for 2004. A pdf file of each of the presentations is available to download from the SMART Group web site or from Nepcon www.nepcon.co.uk Don't forget to keep checking the SMART Group web site for all the results of trials from the Lead-Free Experience which played host to over a 150 engineers during the two days of the show, the full results and photos, x-rays, microsections coming SOON!!! Wednesday 11th June 11.00am Thermal Management
Techniques for Advanced Surface Mount Reliability 12.00 noon Key Note
Presentation In-Stat/MDR State of the Electronics 1.00pm Buying Printed
Boards UK or Far East which is Best? 2.00pm Combined Philosophy
That Delivers Competitive Advantage In Speed, 3.00pm Managing your
Surface Mount Assembly Operation 4.00pm Press Fit Inspection
and Quality Control
11.00am Challenges
in Lead-Free Flexible Circuit Design & Assembly
1.00pm Guide to Changing
to Lead Free Solders, How and When? 2.00pm Inspection
and Quality Control in Automotive Electronics 3.00pm BGA Process
Control and Defect Recognition To download simply select of the speakers from the following list papers are also available from the Nepcon web site www.nepcon.co.uk Don't forget to keep
checking the SMART Group web site for all the results of trials from the
Lead Free Experience, the full results and photos, x-rays, microsections
coming SOON!!! Back to events |
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