SMART Events

Process Technology Seminar Papers at Nepcon 2006
Nepcon Exhibition, NEC Birmingham
9th-11th May 2006

Each of the presentations links presented at the Process Technology Seminars organised by the SMART Group are provided below.

The seminars were sponsored by EM&T magazine and supported by LEADOUT. For further information on LEADOUT and the material available top the industry through this European Project go to www.leadoutproject.com

Tuesday 9th May

Lead-Free Failure Analysis - The Real Story So Far

Stewart McCracken – MCS Limited

Installing Nitrogen Production Capability - Engineers Step by Step Guide

David Hurren – Air Liquide

LEADOUT Report Lead-Free Inspection Criteria for Reflow and Wave Soldering

Rolim Carmo – ISQ, Portugal

Vapour Phase Soldering – Production Experience in Contract Assembly

Nick Quill - Challenger Solutions (Substitute Speaker Bob Willis)

Press Fit Connectors and the Impact of Lead-Free Manufacture

Kevin Canham & Richard Culliford – Harting Connectors

Wednesday 10th May

Lead-Free Design, Manufacture and Assembly of Flexible Circuit Assemblies

Bob Willis – SMART Group

Transition to Lead-Free and Reliability of Mixed Alloy Products

Chris Hunt - NPL

LEADOUT Report Environmental Impact of Lead-Free Production Processes

Aguirre Mugica Patricio– ISQ, Portugal

Testing Products for WEEE and RoHS Compliance Experience

Tom Perrett – Tin Technology/SOLDERTEC

How to Recycle Products and Benefit your Company Recycler

Alan Dukinfield – RID UK Ltd

Thursday 11th May

LEADOUT Report Implementation of Lead-Free Manufacture & Lessons Learned

Simon Mason – TWI

BGA Reliability – Focus on Brittle Ball Fracture

Ben Peecock- DAGE Systems

Design for Disassembly of Electronic Products to Benefit the Environment

Peter Grundy & Bob Willis – PG Engineering & SMART Group

WEEE & RoHS – The Real Life Experience

Nigel Burt – Dolby Laboratory

LEADOUT Report Lead-Free On-Line Training Module Launch

Marta Freitas– ISQ, Portugal

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