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SMART Events
RoHS Compliance & LEADOUT Seminar
Venue: Citywest Hotel, Saggart, Co. Dublin Ireland
Date: Thursday, 22nd Sept 2005

This SMART event was focused on RoHS compliance with particular emphasis on understanding the legislation. Two of the speakers introduced papers, which described the requirements under the Restriction of Hazardous Substances (RoHS) directive and associated Irish implementing regulations, to include substances elimination, exemptions and enforcement. On a more practical note other speakers introduced papers that were implementation based. This seminar was part of the LEADOUT project, its aim is to provide support for engineers faced with the implementation of lead-free manufacture.

Vincent Sinnott, SMART Ireland Chairman, welcomed the group to City West for this seminar.

Meeting the RoHS Obligations

Dorothy Maxwel , Policy Dept, Enterprise Ireland

Whilst most of us are preoccupied with removing lead from our soldering processes, the RoHS and WEEE Directives go further than that and it is important to understand the implications of their impact and transition to national and EU law. This presentation summarised the Directives and how producers can implement. Dorothy's paper described the requirements under the Restriction of Hazardous Substances (RoHS) directive in a very clear, bullet point manner. Introduction to the legislation and its origins were described which included associated Irish implementing regulations, to include substances elimination, exemptions and enforcement. This paper was particularly useful to people in search of a quick overview of the legislation and its effect on their business. Dorothy detailed funding available from Enterprise Ireland for eligible companies in their transition to RoHs

Scope of Application of RoHS Directive

Brendan O'Neill, Senior Adviser, DoEHLG

Although most of Brendan's paper was previously covered by Dorothy some more interesting factors were presented. This paper added an emphasis of whether particular products, product ranges, spare parts and certain specified applications fall within the scope of the Directive. This attracted plenty of questions as delegates were particularly interested in whether certain aspects of the legislation covered their particular situations

Lead Out Project

Vincent Sinnott, Smart Group Ireland Chairman

Vincent briefly described current state of the LEADOUT program and the relevant funding provided by the EU to finance this project. Presentation showed participating companies and their progress so far.



Lead-Free Developments Worldwide

Jason Davis Haerus Materials

Jason's paper detailed the characterisation of a solder paste and effects in a lead free world.
Defects during screen-printing, placement and reflow were examined and put into perspective compared to current leaded process.
Slides showing benchmark testing on solder paste vehicle were shown and described in detail.


The RoHS Directive, Practical Effects of Implementation

John Hegarty Intel Ireland

John's paper was well received by all delegates. It was an interesting mix between back round of RoHS and practical implementation.
John went into detail on the practical elements of engineering, solder paste deposition, wave soldering, rework and repair. Emphasis was put on starting a lead free roadmap and putting it into action.
Also detailed was implications on material handling from components to PCB materials and relevant marking conventions form component manufacturers.

PCB Materials Technology for a Lead Free Environment - Towards a Rapid Implementation for RoHS Compliance

Neil Chilton Circatex Ltd

Neil's presentation showed that the electronics industry needs a better understanding
of the interaction between extreme assembly environments and PCB materials. Of particular concern are the effect on FR4 substrate materials in Pb-free assembly environments and the interaction on product lifecycle reliability. Neil showed vanced analysis methods such as Interconnect Stress Test (IST), coupled with traditional materials analysis techniques to determine the effects of Pb-free assembly. Traditional PCB materials such as NiAu, OSP and Pb free HASL can be used on the FR4 laminate and will be compatible with lead free processing but the need for higher Tg laminates will need to be investigated to push technology forward.

Feedback from the show showed that delegates were happy with the content and found it relevant to their particular situations

Brendan Neary & Ian Farrell
SMART Group Ireland Technical Committee


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