SMART Events

"Again we were pleased to be running the Process Technology Seminars at Nepcon Electronics with the support of TISA. "It's good always fun running the event and we hope visitor enjoyed the wide selection of topical presentations", stated Bob Willis, Seminar Coordinator for the SMART Group.

"We have run the seminars live in the exhibition hall for a number of years, sponsored by Electronics Manufacture & Test magazine, and still see them being very relevant. It's a winning formula for visitors to learn from other engineers and visit all the exhibitors. Its success is due mostly to the down to earth topics we select for the event".

A copy of the presentation is available in pdf file format, just select the presentation you would like the see.

Tuesday 1st October

11.00am - Pushing the Limits of Micro Via and Organic Substrates
Gareth Jones - IBM Microevelectronics

12.00pm - Printed Circuit Board Reliability Through Correct Specification
Dougal Stewart - PWB Solutions

1.00pm - Introduction to Opto Electronics Manufacture
Tim Durrant - Nortel Networks

2.00pm - Environmental Friendly Soldering Materials are they Working
Serge Tuerlings - Litton Kester Solder

3.00pm - Manufacturing Cost Savings with Pin-In-Hole Reflow Assembly
Sue Knight - Sanmina SCI

Wednesday 2nd October

11.00am - Optimisation of Manufacturing Test Using "Complementary Test" Techniques.
Nigel Priest - SPEA

12.00 pm - Benchmarking Assembly and Soldering Yields SMART Group DTI Project
Bob Willis - SMART Group Technical Director

1.00pm - Test Effectiveness: A Metric For Comparing Test Equipment & Test Processes
Mike Fisher - Agilent Technologies Limited

2.00pm - Lead-Free Rework Reliability with Mixed Solder Alloys
Chris Hunt - NPL

3.00pm - Yield Improvement Benefits of Nitrogen Soldering with Tin/Lead and Lead-Free
Chris Hunt - NPL

Thursday 3rd October

11.00am - Getting High Solder Levelling Yields with Tin/Lead and Lead-Free Alloys
Paul Watson - CEMCO

12.00pm - Lead-Free Introduction for High Volume Mobile Phone Production
Steve Dowds - Indium Corporation

1.00pm - What's Best Automatic Optical Inspection or X-Ray Analysis
Michael Smith - Teradyne

2.00pm - 0201 Chip Component Design and Assembly Introduction
Bob Willis - SMART Group Technical Director