SMART Group - Surface Mount and Related Technologies

Agenda

  1. Jun
    9
    Mon

    1. Making Reliable Soldering Joints – Time After Time webinar @ Online Webinar
      2:30 pm – 4:00 pm

      Making or designing a solder joint needs attention to detail if you want to form a reliable interconnection repeatedly. Selecting the correct solder alloy, flux combination, substrate metallisation and component termination is important, just like the design. This webinar will step you through each of the key points so you can create the perfect joint on wave, reflow or selective soldering time and time again.

      For further information or to book you place Click Here

      Topics to be covered include:

      What is the prefect joint?
      Solder alloy options
      High and low temperature soldering
      Monitoring temperatures
      Importance of flux and solderable surfaces
      Intermetallic formation
      Solder Joint failure modes

      Presented by Richard Boyle – Member of the SMART Group Technical Committee

      The webinar last between 60-90min

      For further information or to book you place Click Here

      +
      2:30 pm
      Making Reliable Soldering Joints – Time After Time webinar @ Online Webinar
  2. Sep
    9
    Tue

    1. Making Ball Grid Array & Land Grid Array Rework Simpler to Perform – Webinar @ Online Webinar
      10:30 am – 12:00 pm

      Ball Grid Array and all bottom termination components can bring challenges during rework and repair. Each component is part of mainstream assembly in both low and high volume manufacture. The parts are used in commercial and military products and need to be reliable after any rework process.

      With this webinar we will introduce you to the best procedures and demonstrate many tricks of the trade. In a second part SMART Group will be running a hands on workshop in the UK to put theory into practice. Any delegate that attends the webinar will be entitled to a special discount on the practical session if they want to attend.

      For further information or to make a booking Click Here

      Presentation will be made by Jason O’Dell SMART Group Committee

      Presentation will last between 60-90min

      Topics to Include:

      Removal processes for BGA and LGA package
      Different methods for pad preparation
      Dipping paste and printing paste to packages
      Rework Stencils and requirements
      Re-balling or pre-forms
      Replacement of packages
      Correct temperature profiling
      Inspection criteria
      Common failure modes

      For further information or to make a booking Click Here

       

      +
      10:30 am
      Making Ball Grid Array & Land Grid Array Rework Simpler to Perform – Webinar @ Online Webinar