SMART Group - Surface Mount and Related Technologies

Agenda

  1. May
    12
    Thu

    1. ESD Three steps to Heaven – or, How to achieve compliance with a modern ESD control standard – smart-e-webinar @ Online Webinar
      2:30 pm – 4:00 pm
      A new version of the ESD S20:20 standard was published in 2014, and a new version of the IEC 61340-5-1 standard is expected in 2016. Compliance with these standards requires more than purchase of wrist straps, bench mats and other ESD control equipment.  The User is expected  to write an ESD control program to suit their facility and processes. As each site may implement different ESD control measures, documentation is an essential requirement. Equipment used for ESD control must be selected to do the job intended, and regular testing is needed to make sure it continues to work according to plan. But, all of this would be ineffective if personnel were inadequately trained to put the ESD control measures into practice
      This webinar gives an overview of what is required for compliance with ESD control standards 61340-5-1 and ESD S20:20. It will be of particular interest to those who are considering or actively working towards compliance, or simply want to know how to develop and maintain a modern and effective ESD control program
      Topics include:
      Step 1- Planning for ESD control – (or,  to fail to plan is to plan to fail)
      – the four Plans  of a successful ESD control program
      – who’s responsible?
      – What’s in an  ESD Program Plan?
      – ESD Protected Area requirements
      – essential and non-essential insulators
      – electrostatic field limits and ESD risk
      – ESD ground
      – personal grounding
      – isolated conductors
      – ESD control equipment requirements
      – tailoring
      – What’s the correct ESD packaging?
      – marking
      Step 2 – Selecting ESD control equipment and checking it still works
      – the Product Qualification Plan and Compliance Verification Plan
      – selecting ESD control equipment
      – check regularly that it’s still working as time goes on.
      – standard measurements
      Step 3 – ESD Training
      – people – the biggest ESD threat, or first line of defence?
      – minimum training requirements
      – …and, why you might want to do more…?

      To get the best out of your webinar experience read the following guide:
      Our web based seminars represent an efficient way to develop practical knowledge, delivering expert advice and guidance to you without leaving your workplace. Simple webinars offer a low cost and time efficient training option. They can be accessed from the internet, eliminating the need to take time out of the office and avoid expensive travel cost. Book a meeting room with computer and data projector at your facility and invite your colleagues to join you for a single fee from £65 per session
      The webinar lasts between 60 and 90 minutes. You will receive a copy of the slides after the webinar
      To book you place contact Keith Bryant info@smartgroup.org
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      2:30 pm
      ESD Three steps to Heaven – or, How to achieve compliance with a modern ESD control standard – smart-e-webinar @ Online Webinar
  2. May
    18
    Wed

    1. “Design For Advanced Manufacturing, Failure Analysis incorporating 3D workshop” – SMART Group Ireland (all-day) @ SEAM Facility Waterford IT
      May 18

      This workshop will look at the latest tools available for design for advanced manufacturing, with an in depth look at failure analysis and ways to improve your products. This unique workshop will also look at the latest tools available in terms of 3D printing. Papers and studies  will be presented by the SEAM Group (South Eastern Applied Materials Research Centre) at Waterford IT together with Tyndall National Institute, Cork

      9.30am – Coffee & Registration – Workshop runs from 10.00am to ~3.00pm. Lunch and refreshments included together with facility tour and demonstration.
      South Eastern Applied Materials (SEAM) Research Centre
      An industry dedicated materials research and development facility, currently seed funded under Enterprise Ireland’s Technology Gateway programme;  SEAM – located at Waterford Institute of Technology, has been a success story in expanding opportunities in the Medical Device, Precision Engineering, Pharma and Energy Sectors in Ireland. SEAM’s metallic, polymer and ceramic experience is proving invaluable to its clients due to offerings of its niche technologies (X-ray CT scan, Metal 3D printing & Finite Element Modelling) and materials research capabilities to resolve their day to day process/product and quality related issues
      Introduction and Overview of SEAM Activities – Ramesh Raghavendra
      Ramesh, the Centre Director of SEAM, holds a PhD from University of Twente, The Netherlands and three Master degrees (M.Sc in Materials Sciences, M.S in Metallurgical Engineering and an MBA). In this workshop, Ramesh plans to provide a brief overview of SEAM activities covering Centre’s core capabilities, typical examples of industrial projects executed and how it goes about in assisting manufacturing Industries in Ireland
      Failure Analysis and Design Tools for 3D Metal Printing – Eoghan O’Donoghue
      In this workshop, Eoghan plans to cover two areas. His first part of the talk will focus on Failure Analysis capabilities of SEAM citing typical examples while the second part will focus on providing key design criteria and tools associated with 3D Metal Printing
      SEAM 3D Metal Printing Capability – Oliver McCarthy
      Oliver’s present focus is in the Metal Additive Manufacturing area and in this workshop he plans to provide an overview of SEAM Metal printing capability, in particular detailing the methodology of the printing process and the post processing treatment requirements
      CT Applications to 3D Metal Printed Components – Brendan Phelan
      In this workshop, Brendan will provide a brief overview on the wide ranging applications of XMT/CT and its role as an effective Validation Technique for 3D Metal printed components
      Failure Identification in Electronic Components and Assemblies using CT Scanning and other Techniques – Finbarr Waldron (Tyndall Institute)
      The Tyndall National Institute is one of Europe’s leading research centres in Information and Communications Technology (ICT) research and development, and the largest research facility of its type in Ireland. Finbarr will discuss analytical techniques used to identify failure modes in electronic components and assemblies such as wire bond interconnect, flip-chips, BGAs and advanced multilayer substrates. He will have a particular focus on X-ray and CT scanningFor further information on the workshop and location Click Here
      For further information and to make a booking contact Phillip O’Rouke

       

       

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      “Design For Advanced Manufacturing, Failure Analysis incorporating 3D workshop” – SMART Group Ireland @ SEAM Facility Waterford IT (all-day)
  3. Jun
    30
    Thu

    1. Area Array Design & Assembly including Underfill & Corner Bonding for Increased Reliability smart-e-webinar @ Online Webinar
      2:30 pm – 4:00 pm

      Ball Grid Array packages have been used in the industry for many years. Just like surface mount, the use of BGA’s can affect printed board layout, assembly, inspection and repair process. BGA’s do however provide significant advantages over fine pitch components particularly in terms of process assembly yield. Correct design, printing and profiling is necessary to obtain the highest yields and reliably interconnection. To increase robustness and long term reliability underfill and corner bumping with adhesives have become popular and is also a design consideration
      BGAbannerEveryone blames the BGA if failure occurs often because you can’t see under the package but is it the real failure mode. Bob produced the first video tape and interactive CD-ROM on BGA technology, practical advice is what you get on any of Bobs’ sessions supported by unique video clips to make the session come alive. All staff involved in the process of area array soldering with tin/lead and lead-free BGA assembly processes; including procurement, design engineers, reliability, quality personnel, failure analysts, and management involving is setting standards, inspection and product assessment of boards containing BGA, CSP, LGA and other area array components

      The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar

      Topics include:

      Design rules
      Printed board layout
      Underfill and corner bumping benefits
      Surface finish selection
      Inspection/assembly marks
      Assembly process
      Rework procedures
      BGA failures, Package cracking, Solder balls, Misalignment, Non reflow
      Inspection criteria

      Cost: €90 (Euro) Member €125 (Euro) Non Member

      Please contact Philip O’Rourke of SMART Group Ireland on +353(0)86 806 1998 to reserve your space or email admin@smartgroupireland.com

      Payment can be made via credit/debit card or by Direct payment to SMART Group Ireland’s Bank Account

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      2:30 pm
      Area Array Design & Assembly including Underfill & Corner Bonding for Increased Reliability smart-e-webinar @ Online Webinar
  4. Sep
    14
    Wed

    1. “Developments in Advanced HDI Technology & Embedded Systems workshop” – SMART Group Ireland (all-day) @ Tyndall, Cork
      Sep 14

      This workshop will look at the latest developments in Advanced High Density Interconnect. A HDI PCB is defined as a PCB with a higher wiring density per unit area than conventional PCB. They have finer lines and spaces, smaller vias and capture pads and higher connection pad density than employed in conventional PCB technology. A HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing. The workshop will also look at embedded systems is a computer system with a dedicated function within a larger mechanical or electrical system, often with real-time computing constraints.  It is embedded as part of a complete device often including hardware and mechanical parts. Embedded systems control many devices in common use today. 98 percent of all microprocessors being manufactured are used in embedded systems

      Papers and studies  will be presented by EMC, Cork, together with Tyndall National Institute, Cork.

      Facility Tour included with the workshop.

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      “Developments in Advanced HDI Technology & Embedded Systems workshop” – SMART Group Ireland @ Tyndall, Cork (all-day)
  5. Oct
    13
    Thu

    1. LED Design Assembly and Soldering Process Issues Causes & Cures smart-e-webinar @ Online Webinar
      2:30 pm – 4:00 pm

      LEDs Light Emitting Diodes are common in today’s industry, but now with the growing use of larger boards and more demanding devices there are challenges to each step in the assembly process. There are many different types of LED and limited interchangeability with parts from different suppliers

      The components can be sensitive to moisture and contamination on the surface of the parts impacting performance. During the webinar Bob Willis will explain many of the process issues faced and how to overcome them in manufacture
      LEDBannerWebinar topics include:

      LED design requirements
      Metal/epoxy PCB substrates
      Component specification requirements
      Changes to printing, placement and reflow
      Soldering material considerations
      LED failure modes
      Inspection requirements

      Presented by Bob Willis

      The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar

      Cost: €90 (Euro) Member €125 (Euro) Non Member

      Please contact Philip O’Rourke of SMART Group Ireland on +353(0)86 806 1998 to reserve your space or email admin@smartgroupireland.com

      Payment can be made via credit/debit card or by Direct payment to SMART Group Ireland’s Bank Account

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      2:30 pm
      LED Design Assembly and Soldering Process Issues Causes & Cures smart-e-webinar @ Online Webinar