Month 
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Agenda Agenda
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May22Tue
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From Silicon to Packaging and Introducing the ICMR and the I2E29:30 am – 4:00 pm
Workshop starts at 10.00am with Registration and Coffee from 9.30am. The event will conclude by 3.45pm
Modern Integrated Circuits can contain structures which range in size from nano-meters to millimetres, that’s atomic scale detail in a package you can hold in your hand. This seminar will reveal some of the complexity involved in the production of silicon die. Modern electronic devices are provided in a multitude of different packages which have to be mounted onto a printed circuit board. We will detail some of the common package types in current use and the corresponding process engineering requirements for their successful assembly.
There will also be an introduction to 2 programs for the Irish Manufacturing Industry, the ICMR and the I2E2, with which Intel is involved, a windows tour of the Intel facility and an Introduction to how all this technology can be applied in the Intel Innovation Centre.
Speakers will include John Hegarty – Intel Corporation, Finbarr Waldron – Tyndall National Institute and a speaker from ICMR and the I2E2
For further information and a booking form Click Here
9:30 amFrom Silicon to Packaging and Introducing the ICMR and the I2E2 -
POP, LGA, QFN Designing & Assembly Workshop9:30 am – 4:00 pm
POP, LGA, QFN Designing & Assembly Workshop
Stoke Mandeville Stadium – AylesburyTo book your place or table top exhibition space contact Tony GordonPackage on Package (PoP) and LGA QFN applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. LGA QFN has provided process and quality engineers many challenges over the last couple of years but many of these issues have been addressed.PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.
Each delegate will receive a FREE set of Package on Package inspection and quality control wall charts covering optical and x-ray inspection, dip flux and paste application, placement criteria and defects seen during assembly.
Who should attend?
This event is ideally suited to design, production and quality engineers looking at future technology and maintaining a company technology roadmap. It’s vital to subcontractors to be up-to-date with new technology and its possible implementation along with material and equipment requirements for future customers.
Workshop topics include:
What is Package on Package & LGA QFN?
Component Standards
Component Types
JEDEC Standards
PCB Design Rules
Pad Layout
Via Hole Connection
Lead-Free Assembly
Stencil Printing
POP & LGA QFN Placement
Tack Flux
Dip Solder Paste
Reflow Soldering
Convection
Vapour Phase
Temperature Profiling
Inspection
Optical Inspection
X-ray inspection
Underfill
Rework
Package on Package Defects9:30 amPOP, LGA, QFN Designing & Assembly Workshop
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Jun11Mon
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Guide to Modern Multilayer Manufacture Webinar Part 32:30 pm – 4:00 pm
This series of webinars have been designed for those new to the circuit industry and ideal for design and assembly engineers and purchasing staff as well as suppliers and members of academic groups. This series of focused sessions will provide a clear step by step guide to the manufacture of the modern circuit board and the controls and inspection requirements to obtain trouble free assembly. Even if you can’t attend all four dates don’t worry you will not miss out by booking the complete series, the recordings will be available online
6th March PCB Manufacture Part 1 14.30 GMT
3rd April PCB Manufacture Part 2 14.30 BST
11th June PCB Manufacture Part 3 14.30 BST
5th July PCB Manufacture Part 4 14.30 BSTFor further information and a booking form please Click Here
2:30 pmGuide to Modern Multilayer Manufacture Webinar Part 3
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Jun21Thu
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SMART Scotland IPC 610 & BGA/LGA Rework – Hands on Experience Workshop9:00 am – 3:30 pm
Continuing on from our last very successful Technical Seminar on the Back to Basics : Inspection Techniques, we would like to invite you to the next seminar in this series. This is an invaluable opportunity to learn about advancements in rework technology and IPC 610
For further information and a booking form Click Here
Although none of us want rework, it is currently a necessary evil. This is incredible value and therefore, this is an opportunity not to be missed, learn the easy way, learn from Others, learn the best techniques from industry experts. We will also be discussing Continuous improvement, Lean Manufacture and establishing/monitoring the cost of rework, explaining quality tools to help reduce costs.
Workshop starts at 9.30am with coffee from 9:00 am. The event will conclude by 4.00pm A buffet lunch will also be served
We will have industry experts on hand doing presentations on topics such as IPC 610, The Rework Environment, Health & Safety, Fume Extraction, Fluxes/Solders, selection of soldering irons/equipment, reworking of BGAs, QFNs, LGAs etc… Continuous Improvement and Lean Manufacture, establishing understanding the cost of rework.
In the Afternoon and during the day, we will have various rework equipment for hands on trials, although our plan is to have boards available for rework, please bring your own. The more complex the better, and we will have experts on hand and rework apparatus to help you remove/rework them, this is an exceptional opportunity to improve your rework skills.
At the end of the seminar there will be an opportunity to have a plant tour of the facilities at BAE Systems
For further information and a booking form Click Here
Questions & Answers
At the end of the seminar we will have a question and answer session, to answer any further questions not covered in the day
We will have to hand some of the industries experts in one place, an ideal opportunity to both network and gain an understanding into this very technical and demanding technology.
Please note all presentations will be supplied on a Memory Stick for future reference
Who should attend?
If you are involved in SMT assembly as a Line Manager, Process Engineer, Line operator or QA/QC then this seminar will add real benefit to your techniques to improve your ability to rework complex boards
9:00 amSMART Scotland IPC 610 & BGA/LGA Rework – Hands on Experience Workshop
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Jun27Wed
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Test Day for Electronics9:30 am – 4:00 pm
Is testing products, particularly electronic ones, a necessary evil to prove to customers that products have passed some kind of criteria? Or is it an integral part of the manufacturing process that provides reports during manufacturing so that processes can be controlled? Or is it both? These notions will be explored and various methods of test will be highlighted.
Who should attend?
Anyone involved in the manufacturing process should be there but engineers from design, test, QA and process control should commit to this. As well as the “coal-face” people mentioned here, this seminar will also have relevance to Managers and Financial controllers.
Topics Covered:
To test, or not to test. That is the question. Unashamedly, this has no reference to Shakespeare but sets the scene for thoughts on test strategies.
Cleaning. Is this relevant to test?
HALT/HASS. Is the product designed to be fit for purpose or should advanced testing show weaknesses?
MDA/ICT. Can the process survive without fixture test? What’s involved? This includes an expose on fixtures and programming. It also includes an analysis of Flying Probe techniques
Boundary Scan and its benefits
AOI/X-Ray/SPI
Traceability and data collection
Visit to a shop floor that uses test as an organised strategy9:30 amTest Day for Electronics
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Jul5Thu
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Guide to Modern Multilayer Manufacture Webinar Part 42:30 pm – 4:00 pm
This series of webinars have been designed for those new to the circuit industry and ideal for design and assembly engineers and purchasing staff as well as suppliers and members of academic groups. This series of focused sessions will provide a clear step by step guide to the manufacture of the modern circuit board and the controls and inspection requirements to obtain trouble free assembly. Even if you can’t attend all four dates don’t worry you will not miss out by booking the complete series, the recordings will be available online
6th March PCB Manufacture Part 1 14.30 GMT
3rd April PCB Manufacture Part 2 14.30 BST
11th June PCB Manufacture Part 3 14.30 BST
5th July PCB Manufacture Part 414.30 BSTFor further information and a booking form please Click Here
2:30 pmGuide to Modern Multilayer Manufacture Webinar Part 4
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Aug14Tue
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Flexible Circuits – A Guide to Assembly and Inspection Webinar2:30 pm – 4:00 pm
The flexible circuit is another packaging technology which has seen wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don’t; many flexibles are designed purely to aid the circuits design and assembly into a final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad.
For a booking form Click Here
Topics include
Flexible Design for assembly
Manual assembly and soldering
Automatic assembly process requirements
The need for baking flexible circuits
Flexible circuit pallets for automatic assembly
Screen printing, placement, reflow soldering & AOI
Manual hand soldering and de-soldering
Rework of conventional and surface mount
Solder joint Inspection
Process defects on flexible circuits and during assemblyFor a booking form Click Here
2:30 pmFlexible Circuits – A Guide to Assembly and Inspection Webinar
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Sep11Tue
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Beginners Guide to Surface Mount Manufacture – Webinar2:30 pm – 4:00 pm
To book your place Click Here
2:30 pmBeginners Guide to Surface Mount Manufacture – Webinar
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Sep18Tue
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SMART Group Annual Two Day Conference (all-day)Sep 18 – Sep 19
SMART Group European Conference on Packaging, Assembly and Reliability plus Table Top Exhibition
18-19th September, Spread Eagle Hotel, Cornmarket, Thame, Oxfordshire, EnglandThe Big Zero Conference – Design and Build Reliability
Table top booking form go to Click Here
If your goal is O% rework, O% field failures SMART Group’s exciting 2 day conference is for you! This year we are concentrating on design, production and reliability of electronic assemblies with particular emphasis on new components and assembly technologies.
Topics planned include:
Design for manufacture and reliability of high density devices
Design, fabrication and reliability of advanced circuit boards
Solder paste application and alloy selection for high density interconnection
Soldering of high density packages
Cleaning and conformal coating
Component packaging developments
Thermal management
Mitigation techniques for tin whiskers
Reliability and testing regimes
Novel materials, bonding, processing, packaging techniques and technologiesCome and listen to industry experts and take time to network with colleagues.
There will be a table top exhibition; to book exhibition space contact Tony Gordon on (+44) 01404 465217 or for a booking form go to Click Here
Two Day Conference Pass £195 for SMART Members: £350 non-members + VAT
One Day Conference Pass £99 for SMART Members: £195 non-members + VAT
Prices include arrival drinks, mid- morning drinks, lunch, afternoon drinks
Delegates will receive links to the proceedings immediately following the eventSMART Group Annual Two Day Conference (all-day)
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Sep20Thu
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Product Reliability & Failure Analysis Workshop9:30 am – 4:00 pm
Product Reliability & Failure Analysis Workshop
Tyndall National Institute, CorkSeminar starts at 10.00am with coffee and table top exhibition from 9:30 am. The event will conclude by 4.00pm
Delegates will also be able to see different analysis techniques and find what a laboratory service will require when you need to arrange your own study. The workshop is conducted by Finbarr Waldron & Bob Willis who offer failure analysis services to the industry and have long been regarded as leading specialist in mechanicals and analytical assessment. The workshop is sponsored by Tyndall National Institute and will also include a tour of the facility at Tyndall and its failure analysis laboratory
For further information and a booking form FA2012
9:30 amProduct Reliability & Failure Analysis Workshop
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