−Beginners Guide to ESD – Webinar2:30 pm – 4:00 pm
Beginners Guide to ESD
Tuesday, 13th October 2015, 14.30 – 16.00 UK Time
When handling most of today’s electronic components, printed circuit assemblies (PCAs) or equipment that contains electronics, special consideration must be given to the potential damaging consequences resulting from static electricity. Electrostatic discharge (ESD) can result in PCAs or higher level equipment failing test in the factory, or worse still, it can result in latent defects that can cause subsequent failure in the field. So what is electrostatic discharge and how is electrostatic discharge damage prevented?
This webinar provides an elementary guide to the principles of ESD control, looking at the basic theory behind the subject and the practical methods that can be adopted used to enable components, PCAs and equipment to be handled without the risk of incurring electrostatic related damage. The webinar is aimed at personnel who are new to the industry, including design and process / manufacturing engineers, technicians, trainers and also at those who support manufacturing indirectly (i.e. purchasing, account managers, sales staff etc…).
Topics include: –
* What is ESD and why is it important
* How static charges are generated
* How static charges can be transferred to electronic components
* Illustration of the damage that can be sustained by electronic components following electrostatic discharge
* What is an Electrostatic discharge Protected Area (EPA)
* How to set up an EPA within a factory
* What practical controls are required to prevent electrostatic damage
* How to store / transport electrostatic sensitive components / PCAs
* How to handle electrostatic sensitive equipment out in the field
SMART Group price is £65 plus VAT for members and £85.00 plus vat for non members
Please contact Paula Muller, Business Manager, SMART Group on 02084322741 or 07504 231575 to reserve your space or email firstname.lastname@example.org. Payment can be made via BACS or credit/debit card.
Book a place for you or your engineering team today
SMART Group is also offering a range of smart-e-webinars to complement its existing interactive CD-ROM,
Hands On and Theory training to companies in the electronics industry. SMART has always been innovative and keen to provide different types of education and support to the industry. smart-e-webinars are ideal learning opportunities for individuals or groups of engineers and will be presented by leading engineers in the electronics industry. Each session lasts between 60-90 min and allows a cost effective alternative to existing educational events without the hassle of travel. To participate in a smart-e-webinar all you need is a broadband internet connection, PC and headset microphone/headphones. Alternatively for groups in a conference room you use a PC with speakers, broadband connection and projector plus conference Microphone
To get the best out of your webinar experience read the following guide:
http://www.smartgroup.org/images/stories/howwebinarwork.pdf smart-e-webinar booking form
Our web based seminars represent an efficient way to develop practical knowledge, delivering expert advice and guidance to you without leaving your workplace. Simple webinars offer a low cost and time efficient training option. They can be accessed from the internet, eliminating the need to take time out of the office and avoid expensive travel costs.
Book a meeting room with computer and data projector at your facility and invite your colleagues to join you for a single fee from £65 per session.
Technical seminars last 60-90mins with the opportunity to ask questions during or at the end of the session. The events are scheduled on different manufacturing topics of interest to engineers and production staff working in printed circuit board assembly.+2:30 pmBeginners Guide to ESD – Webinar
−NPL/SMART Solder Paste Print & Reflow Problems – Causes & Cures – Productronica Webinar2:30 pm – 4:00 pm
Printing solder paste or other conductive material requires zero defects printing if a high first pass yield is to be achieved when using fine pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect?
Correct printer set-up, good stencil design and manufacture plus consistent printing materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three dimensional inspections is required in other AOI applications like solder joint analysis. There are common process defects during printing and reflow and with this webinar we show you the causes and cures to help your yield improvement. The best question on the webinar or at the show will win a set of IPC Standards covering solder paste, stencil design, printing and solder joint inspection. To book your FREE place Click Here
Webinar will be presented by Bob Willis Productronica Process Feature Organiser and is part of a special feature area at Productronica 2015 in Germany November 10 – 13th
Solder paste inspection standards
Soldering yield impact with poor printing
Common solder paste defects
Impact on reliability based on paste thickness
Solder joint inspection defects
Common process defects causes and cures
A copy of each of the slides presented will be sent out after the webinar. The webinar will run for between 60-90min with question and answer session and limited to 100 people. If the webinar is full a recording should be available shortly after the event, to book your FREE place Click Here+2:30 pmNPL/SMART Solder Paste Print & Reflow Problems – Causes & Cures – Productronica Webinar
−NPL/SMART Solder Paste and Solder Joint Automatic Inspection Experience (all-day) @ Productronica 2015Nov 10 – Nov 13
Meet members of the SMART Group, NPL and our partners in the “Solder Paste and Solder Joint Automatic Inspection Experience” at Productronica
Join us at Productronica 2015 for this year’s special feature area, supported by NPL & SMART Group, it will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly. It will also include AOI inspection of printed board assemblies for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show our machines’ capabilities. The feature is being organised by Bob Willis for information contact email@example.com
National Physical Laboratory (NPL) Defect Database Live
The feature will also include “NPL Defect Database Live,” where you can get free process support on all of the printing and inspection defects. Send images of your defects before the show or bring boards for discussion with our team. Get free advice and consultancy all show long. You can email your problems to be answered at the show to firstname.lastname@example.org
Pre-event Webinar: Solder Paste Inspection, Quality Control, Common Print and Reflow Problems – Causes & Cures
Monday 19th October 2.30pm GMT
Prior to the show we will be holding a pre event webinar which will be free for engineers to attend. The webinar will cover Solder Paste Inspection, Quality Control, Common Print and Reflow Problems – Causes & Cures. The webinar will be held on Monday 19th October at 2.30pm GMT to register Click Here+NPL/SMART Solder Paste and Solder Joint Automatic Inspection Experience @ Productronica 2015 (all-day)
−Printed Circuit Board Failures – Causes & Cures – smart-e-webinar2:30 pm – 4:00 pm
Printed Circuit Board Failures – Causes and Cures
Presented by Bob Willis
Tuesday, 17th November 2015, 14.30 – 16.00 UK Time
The printed circuit board is the building block of any electronic assembly and as such must exceed specification and be totally compatible with the assembly processes used in modern assembly. Failures in PCBs can be cosmetic, often the most common reason for rejection in manufacture or assembly. Failures can be found during assembly and final test which are not ideal but much better than field returns.
In his presentation Bob will highlight test methods you can try and tricks of the trade to understand how PCBs can fail and how to eliminate many of the common causes. After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session. A copy of the slides is sent to each delegate after the webinar
Selected topics covered
Through hole plating failures
CAF contamination shorts
Nickel/Gold – Black pad & Black Tar
Inner layer separation
Solder mask cracking
Need for product specifications
Auditing a PCB supplier
SMART Group price is £65 plus VAT for members and £85.00 plus vat for non members
Please contact Paula Muller, Business Manager, SMART Group on 02084322741 or 07504 231575 to reserve your space or email email@example.com. Payment can be made via BACS or credit/debit card
Book a place for you or your engineering team today
SMART Group is also offering a range of smart-e-webinars to complement its existing interactive CD-ROM, Hands On and Theory training to companies in the electronics industry. SMART has always been innovative and keen to provide different types of education and support to the industry. smart-e-webinars are ideal learning opportunities for individuals or groups of engineers and will be presented by leading engineers in the electronics industry. Each session lasts between 60-90 min and allows a cost effective alternative to existing educational events without the hassle of travel. To participate in a smart-e-webinar all you need is a broadband internet connection, PC and headset microphone/headphones. Alternatively for groups in a conference room you use a PC with speakers, broadband connection and projector plus conference Microphone
To get the best out of your webinar experience read the following Webinar Guide
Book a meeting room with computer and data projector at your facility and invite your colleagues to join you for a single fee from £65 per session
Technical seminars last 60-90mins with the opportunity to ask questions during or at the end of the session. The events are scheduled on different manufacturing topics of interest to engineers and production staff working in printed circuit board assembly+2:30 pmPrinted Circuit Board Failures – Causes & Cures – smart-e-webinar
−Rapid Oven Setup & PCB Profiling – Seminar @ The Manufacturing Technology Centre10:00 am – 4:00 pm
Rapid Oven Setup & PCB Profiling
The profiling process has been carried out for several decades and the equipment suppliers, thermocouple manufacturers and measuring instruments have worked well and achieved a good standard of profiling.
As there is an increase in demand for complex PCB whether in tin lead or lead-free many components now being subjected to temperatures close to or in excess of their designed maximum.
With these challenges in mind it is imperative that the engineer is able to measure assembly temperatures accurately during the soldering process.
This one day seminar brings all the specialists under one roof to tackle the issues here at the MTC Coventry.
Best practices in profiling
A guide to selecting the correct thermocouple for your process.
Good use of the data logger.
The issues arising for poor profiling.
In-Process control in reflow oven.
Saving energy using your reflow oven.
Better understanding of your reflow oven.
Who should attend?
This event is ideally suited to any member of staff working in electronics manufacturing and design. Engineers will benefit from a fuller understanding of the issues currently being experienced in profiling PCB.
For more information and to may a booking Click here+10:00 amRapid Oven Setup & PCB Profiling – Seminar @ The Manufacturing Technology Centre
−Ion Chromatography – Smart-e-Webinar2:30 pm – 4:00 pm
Ion chromatography is a tool finding increasing use in the electronics industry for determining the cleanliness levels of printed boards and assemblies. This webinar will cover the basics of what ion chromatography is, how it is used to determine electronic cleanliness, critical equipment considerations if you are considering developing this capability, what IC based specifications exist and how they were derived, and how you would use this tool for process troubleshooting and optimization.
Doug Pauls, Rockwell Collins, will be the presenter and presently serves as the IPC Cleaning and Coating Chair. He has over 25 years experience in using IC for electronics assembly improvement.
Topics will include:
+2:30 pmIon Chromatography – Smart-e-Webinar
- What is ion chromatography.
- What do you need to do get started.
- How it helps to set up your processes.
- How it helps you to diagnose when something goes wrong.
−Industry 4.0 is coming! – Webinar2:30 pm – 4:00 pm
Anyone who has attended major International Exhibitions over the past year could not help but see a huge number of multi-national equipment manufacturers claiming they are Industry 4.0 ready. In this webinar we will introduce the concept and detail and explain specific examples of the benefits i4 can bring to your business.+2:30 pmIndustry 4.0 is coming! – Webinar
−Selective Soldering, Design, Process Challenges & Practical Solutions – Workshop (all-day) @ To be confirmedFeb 10
Selective Soldering, Design, Process Challenges & Practical Solutions
For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a tin/lead and lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities.
In this workshop the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Inspection Wall Charts covering soldering of lead-free terminations and common defects found in manufacture.
During the workshop there will be a short time spend on alternative selective soldering processes like robotic point and laser soldering for high and low temperature soldering and the use of low temperature solders for surface mount and through hole parts
Process engineers tasked with process introduction, quality staff, and supervisors wanting to understand the process issues with lead-free selective soldering. Design engineers will benefit from a better understanding of the process they are designing circuit boards to pass through. The workshop may also benefit material, equipment suppliers to have a better understand of all the issues and interactions with new alloys and modern printed circuit design.
This session will cover:
Why use selective soldering
User experience of selective wave point soldering with lead-free
PCB design rules for selective soldering
Changes to pad and interlayer connection pads to increase solder fill
Flux requirements for selective soldering
Compatibility of solder masks and lead-free solder
Setting up tin/lead & lead-free profiles, you must profile a selective process!!!
Solder alloy choices and copper dissolution reduction
Inspection criteria for selective and impact on reliability
Through hole joint strength & long term reliability
Copper dissolution with selective and how to avoid it
Soldering defects on selective – Most Common Causes & Cures
Dendrite growth – Solder balling – Copper pad removal – Poor penetration – Copper saturation – Copper needles – Iron needle shorts+Selective Soldering, Design, Process Challenges & Practical Solutions – Workshop @ To be confirmed (all-day)
−Industry 4.0 is Coming! – Seminar (all-day) @ Electronics YorkshireMar 16
There has been a lot of talk about Industry 4.0 and know it’s time for action! The trends, such as big data, mass customisation and cyber physical systems, that have driven us to this point are becoming increasingly important and as more OEMs look to be Industry 4.0 ready in their supply chain. It’s essential that manufacturers and suppliers understand what it all means and what it can offer them as well as their customers and the consumer.+Industry 4.0 is Coming! – Seminar @ Electronics Yorkshire (all-day)