Month 
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Agenda Agenda
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Mar6Tue
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Guide to Modern Multilayer Manufacture Webinar Part 12:30 pm – 4:00 pm
This series of webinars have been designed for those new to the circuit industry and ideal for design and assembly engineers and purchasing staff as well as suppliers and members of academic groups. This series of focused sessions will provide a clear step by step guide to the manufacture of the modern circuit board and the controls and inspection requirements to obtain trouble free assembly. Even if you can’t attend all four dates don’t worry you will not miss out by booking the complete series, the recordings will be available online
6th March PCB Manufacture Part 1 14.30 GMT
3rd April PCB Manufacture Part 2 14.30 BST
11th June PCB Manufacture Part 3 14.30 BST
5th July PCB Manufacture Part 4 14.30 BSTFor further information and a booking form please Click Here
2:30 pmGuide to Modern Multilayer Manufacture Webinar Part 1
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Mar13Tue
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Advances in PCB Assembly Technology9:30 am – 4:00 pm
Henkel Ireland, Tallaght, Dublin 24
9.30am – Coffee & Registration – Seminar starts at 10.00am. Lunch and refreshments included
For further details and a booking form Click Here
Technology, economics, new materials and processes are key factors in selection for future product designs. Often there are competing requirements during the selection process. This event is a unique opportunity to hear the latest advances in production processes in manufacture. Delegates will be able to compare materials & processes to see if they meet their future needs.
The workshop will cover:
Solder Alloys for High & Low Temperature Applications
Conductive Adhesives
Area Array Package Assembly Requirements
Underfilling Processes
Underfill Materials and Reliability
Convection or Vapour Phase Reflow
Selective Reflow or Selective Soldering
Advances in Soldering Materials
Conformal CoatingFor further details and a booking form Click Here
Who should attend?
If you are involved in PCB design or procurement, SMT assembly as a Line Manager, Process Engineering or QA then this workshop will bring you up to date with new materials and processes. This is particularly true if you are subcontracting your products for assembly or if you are a subcontractor tasked with looking at new process introduction. It’s an ideal way of asking and finding out what is actually happening in industry today
The SMART Group supports the uBGA European Project FP7-SME-2008-2-243653
9:30 amAdvances in PCB Assembly Technology
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Apr3Tue
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Guide to Modern Multilayer Manufacture Webinar Part 22:30 pm – 4:00 pm
This series of webinars have been designed for those new to the circuit industry and ideal for design and assembly engineers and purchasing staff as well as suppliers and members of academic groups. This series of focused sessions will provide a clear step by step guide to the manufacture of the modern circuit board and the controls and inspection requirements to obtain trouble free assembly. Even if you can’t attend all four dates don’t worry you will not miss out by booking the complete series, the recordings will be available online
6th March PCB Manufacture Part 1 14.30 GMT
3rd April PCB Manufacture Part 2 14.30 BST
11th June PCB Manufacture Part 3 14.30 BST
5th July PCB Manufacture Part 4 14.30 BSTFor further information and a booking form please Click Here
2:30 pmGuide to Modern Multilayer Manufacture Webinar Part 2
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May3Thu
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PCB Solderable Finishes – Paste & Flux Compatibility9:30 am – 4:00 pm
Workshop starts with coffee from 9:30 am. The event will conclude by 4.00pm
To book you place Click Here
This workshop will look at the benefits and disadvantages of ENIG, OSP, Immersion Silver, tin and solder leveling as current options for printed circuit board solderable finishes. The session will also review the performance during PCB fabrication and assembly plus some of the common process problems experienced in industry. The Workshop will conclude with a practical session where delegates will be able to see firsthand the use of such finishes in manufacture. Each delegate at the event will receive a copy of the SMART Group Surface Finish Poster Guide
Workshop includes:
Overview of the surface finish selection criteria
How finishes will influence its performance in assembly
Correct selection of paste and flux for different surface finishes
Latest developments in fluxing technology
Common process problems relating to the PCB solder finishes
Impact on long term storage of PCBs
Practical hands on session, printing and reflow
To book you place Click Here
Question time – For analysis on the day email your failure photos to technical@smartgroup.org
Who should attend?The workshop is ideally suited to all persons involved in the Design, Specification, Manufacture and Quality Control of Printed Circuit Assemblies, including Design Engineers, Production Engineers and Quality Engineers. It will assist purchasing executives understand the different options when discussing issues with their supply chain and the compatibility with different flux and paste combinations
9:30 amPCB Solderable Finishes – Paste & Flux Compatibility
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May10Thu
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Lead-Free Experience Workshop – 6 Years On!!9:30 am – 4:00 pm
Enterprise Ireland, Dublin 3
Seminar starts at 10.00am with coffee and table top exhibition from 9:30 am. The event will conclude by 4.00pm
Although lead-free manufacture has been in full swing for over ten years it’s just six when many companies were legally required to change production methods or arrange with their subcontractors to use alternative materials. If you are using lead-free or if you are new to the technology this session should provide you with answers to the most common process issues. This SMART Group Ireland workshop is an ideal opportunity to bring any troublesome design and process issues for discussion. The workshop is sponsored by Enterprise Ireland and presented by Bob Willis
For further information and a booking for this event LFWorkshopIreland2012
9:30 amLead-Free Experience Workshop – 6 Years On!!
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May15Tue
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ESD – Principles and Control in Manufacturing Webinar2:30 pm – 4:00 pm
Presented by Jeremy Smallwood
To book your place Click Here
2:30 pmESD – Principles and Control in Manufacturing Webinar
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May22Tue
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POP, LGA, QFN Designing & Assembly Workshop9:30 am – 4:00 pm
POP, LGA, QFN Designing & Assembly Workshop
Stoke Mandeville Stadium – AylesburyTo book your place or table top exhibition space contact Tony GordonPackage on Package (PoP) and LGA QFN applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. LGA QFN has provided process and quality engineers many challenges over the last couple of years but many of these issues have been addressed.PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.Each delegate will receive a FREE set of Package on Package inspection and quality control wall charts covering optical and x-ray inspection, dip flux and paste application, placement criteria and defects seen during assembly.Who should attend?This event is ideally suited to design, production and quality engineers looking at future technology and maintaining a company technology roadmap. It’s vital to subcontractors to be up-to-date with new technology and its possible implementation along with material and equipment requirements for future customers.Workshop topics include:
What is Package on Package & LGA QFN?
Component Standards
Component Types
JEDEC Standards
PCB Design Rules
Pad Layout
Via Hole Connection
Lead-Free Assembly
Stencil Printing
POP & LGA QFN Placement
Tack Flux
Dip Solder Paste
Reflow Soldering
Convection
Vapour Phase
Temperature Profiling
Inspection
Optical Inspection
X-ray inspection
Underfill
Rework
Package on Package Defects9:30 amPOP, LGA, QFN Designing & Assembly Workshop
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May24Thu
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From Silicon to Packaging and Introducing the ICMR and the I2E29:30 am – 4:00 pm
Workshop starts at 10.00am with Registration and Coffee from 9.30am. The event will conclude by 3.45pm
Modern Integrated Circuits can contain structures which range in size from nano-meters to millimetres, that’s atomic scale detail in a package you can hold in your hand. This seminar will reveal some of the complexity involved in the production of silicon die. Modern electronic devices are provided in a multitude of different packages which have to be mounted onto a printed circuit board. We will detail some of the common package types in current use and the corresponding process engineering requirements for their successful assembly.
There will also be an introduction to 2 programs for the Irish Manufacturing Industry, the ICMR and the I2E2, with which Intel is involved, a windows tour of the Intel facility and an Introduction to how all this technology can be applied in the Intel Innovation Centre.
Speakers will include John Hegarty – Intel Corporation, Finbarr Waldron – Tyndall National Institute and a speaker from ICMR and the I2E2
For further information and a booking form Click Here
9:30 amFrom Silicon to Packaging and Introducing the ICMR and the I2E2
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Jun11Mon
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Guide to Modern Multilayer Manufacture Webinar Part 32:30 pm – 4:00 pm
This series of webinars have been designed for those new to the circuit industry and ideal for design and assembly engineers and purchasing staff as well as suppliers and members of academic groups. This series of focused sessions will provide a clear step by step guide to the manufacture of the modern circuit board and the controls and inspection requirements to obtain trouble free assembly. Even if you can’t attend all four dates don’t worry you will not miss out by booking the complete series, the recordings will be available online
6th March PCB Manufacture Part 1 14.30 GMT
3rd April PCB Manufacture Part 2 14.30 BST
11th June PCB Manufacture Part 3 14.30 BST
5th July PCB Manufacture Part 4 14.30 BSTFor further information and a booking form please Click Here
2:30 pmGuide to Modern Multilayer Manufacture Webinar Part 3
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Jul5Thu
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Guide to Modern Multilayer Manufacture Webinar Part 42:30 pm – 4:00 pm
This series of webinars have been designed for those new to the circuit industry and ideal for design and assembly engineers and purchasing staff as well as suppliers and members of academic groups. This series of focused sessions will provide a clear step by step guide to the manufacture of the modern circuit board and the controls and inspection requirements to obtain trouble free assembly. Even if you can’t attend all four dates don’t worry you will not miss out by booking the complete series, the recordings will be available online
6th March PCB Manufacture Part 1 14.30 GMT
3rd April PCB Manufacture Part 2 14.30 BST
11th June PCB Manufacture Part 3 14.30 BST
5th July PCB Manufacture Part 414.30 BSTFor further information and a booking form please Click Here
2:30 pmGuide to Modern Multilayer Manufacture Webinar Part 4
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