SMART Group - Surface Mount and Related Technologies

Agenda

  1. Jun
    5
    Mon

    1. Passive 01005 & Beyond – Design, Assembly & Inspection Solutions @ Online Webinar
      2:30 pm – 3:30 pm

      All our webinars are based on UK time you can check the time in your location Click Here

      With the ever-increasing miniaturisation and complex features of modern electronic products, there is a growing demand for more densely populated, smaller printed circuit boards.
      Bob Willis 0201 bannerIn general, the majority of devices used on a PCB are passives, therefore a reduction in component size from 0402 – 01005 will free-up PCB real estate. The introduction of 0201 or 01005 does however have its drawbacks. The pad sizes required are more difficult to etch, print, and parts required to be placed with a higher degree of accuracy. The reflow process may also cause defects through the movement of parts, whilst the package size makes inspection and repair more complicated. We will also illustrate the experience gained to date on a number of assembly trials

      Bob has been active with small passive investigations over the last 10 years starting with 0201, 01005 and now the smallest parts half the size of 01005

      After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session

      Each webinar last approximately 60-90mins with the opportunity for questions. To book your place Click Here

      Presented by Bob Willis

      Topics include:

      01005 0201 Chip Component Technology
      Component Packaging issues
      PCB Design Requirements
      Stencil & Paste Implications
      Chip Component Placement Requirements
      Reflow Soldering Defects & Prevention
      Defects caused by reflow
      Rework & Repair methods for miniture chips

      A copy of the slides presented during the webinar are provided at the end of the event.

      For further information on sponsorship of this or other webinars to your customers contact Keith Bryant

      For further information on sponsorship of this or other webinars to your customers contact Keith Bryant info@smartgroup.org

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      2:30 pm
      Passive 01005 & Beyond – Design, Assembly & Inspection Solutions @ Online Webinar
  2. Jul
    10
    Mon

    1. PCB Microsectioning, Analysis of Failure & Quality Standards @ Online Webinar
      2:30 pm – 4:00 pm

      Producing a microsection is a very valuable and cost effective way of assessing PCB defects, component failures or solder joint quality. Understanding the steps in producing a section can be an invaluable tool in failure analysis. Microsection assessment is also an important skill when looking at suppliers testing facility or interpreting results from you PCB supplier during process audits
      microsectionTopics covered in the webinar include:

      Microsection tools and materials
      IPC Inspection standards
      Cutting samples without damage
      Mounting PCB or component positions
      Sanding, polishing and etching samples
      Assessment of results
      Measuring methods
      General photography and SEM assessment
      Recording results and report preparation

      For further information on sponsorship of this or other webinars to your customers contact Keith Bryant info@smartgroup.org

      To make your webinar booking Click Here

      Delegates receive a copy of the slides presented and a FREE copy of the Bob Willis poster guide to PCB Manufacture and a set of Microsection Inspection Reference/Defect Charts for use in their own factory

      To make your webinar booking Click Here

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      2:30 pm
      PCB Microsectioning, Analysis of Failure & Quality Standards @ Online Webinar
  3. Aug
    14
    Mon

    1. Solderability Benchmarking, Failures & Testing Methods @ Online Webinar
      2:30 pm – 4:00 pm

      All our webinars are based on UK time you can check the time in your location Click Here

      solderabilitybannerBenchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratory. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry. Understanding how to conduct simple shop floor assessment of components or using laboratory test methods will be discussed along with artificially age coatings to simulate their useful life. Solderability can impact yield and reliability and making sure engineers understand the test methods onsite, or when subcontracting you’re testing to a laboratory, is key to ascertaining the correct root cause of your process problem.

      The webinar will last approximately 60-90mins including a question and answer session for your process problems. If you have a specific process problems and you will be a delegate on the solderability session send it to SMART to include in the webinar defects

      To get further details and a booking form Click Here

      Presented by Bob Willis

      Topics covered:

      Test specifications
      Test methods
      Selecting the best procedure
      Ageing samples
      Assessment of results
      Solderability failures

      The webinar material includes slides from the event, solderability testing wall charts and design files for solderability test board to use in your factory

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      2:30 pm
      Solderability Benchmarking, Failures & Testing Methods @ Online Webinar
  4. Sep
    11
    Mon

    1. PCB Outgassing & How to Test Bare or Assembled Boards @ Online Webinar
      2:30 pm – 3:30 pm

      All our webinars are based on UK time you can check the time in your location Click Here

      Bob Willis gassing bannerPrinted circuit boards outgas during soldering causing solder voids, solder balls and other process problems. Outgassing can occur in wave, selective and reflow soldering and it’s important first to non-destructively test samples to find the root cause. It’s possible to test bare or assembled boards to examine the potential for failure and eliminate some of the popular misconception in industry. There some different methods which can easily be conducted in manufacture before proceeding to costly laboratory analysis and we show you how to do it and the typical results you can find!!

      The webinar will last approximately 60-90mins including question and answer session

      Presented by Bob Willis

      Topics covered:

      Type of outgassing from vias, through holes and solder masks
      How to Test samples in manufacture
      Test method procedures
      Type of defects and how they can appear with tin/lead and lead-free alloys
      Void formation in wave selective and PIHR joints
      Correct specification of your boards

      A copy of the slides presented during the webinar are provided at the end of the event along with a written procedure for testing

      For further information on sponsorship of this or other webinars to your customers contact Keith Bryant info@smartgroup.org

      To make your webinar booking Click Here

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      2:30 pm
      PCB Outgassing & How to Test Bare or Assembled Boards @ Online Webinar
  5. Oct
    17
    Tue

    1. Solder Shorts & How to Eliminate Them – In Selective & Wave Soldering @ Online Webinar
      2:30 pm – 3:30 pm

      All our webinars are based on UK time you can check the time in your location Click Here

      soldershortbanner2Solder short and unsoldered joints are fundamental defects in manufacture and can occur due to design, process change, change in materials or poor process set-up. Some fundamental choices in the methods of assembly and soldering process will increase solder shorts and this session will look at the causes and cures of the solder short

      For further information on sponsorship of this or other webinars to your customers contact Keith Bryant info@smartgroup.org

      To make your webinar booking Click Here

      During the session, your presenter will show many causes of solder shorts forming and different solutions to the problem, both process and design tricks of the trade. Process tricks are particularly useful to the contract assembler finding it difficult to get design changes pasted customers. However, many changes in design are very simple, quick and will have no impact on function, reliability or product operation. Some suggestion allows for greater design density and reduce the possibility of product failure

      Presented by Bob Willis who spent many years running the Electrovert Wave Soldering Master Class, both one and two-day theory and hands on training in Europe. Bob still runs his own courses on selective and wave soldering for customers worldwide

      Each webinar last approximately 60-90 mins with the opportunity for questions on you process issues. Registered delegates on the webinar can send their own problem images for discussion during the webinar

      Topics covered include:

      Selective & wave soldering process
      Flux activity & De-Activation
      Solder drainage & cooling rates
      Wetting speed
      Design & layout
      Solder shorts
      Solder flags
      Solder whisker
      Impact of solder pallet design
      Process optimisation

      A copy of the slides presented during the webinar are provided at the end of the event

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      2:30 pm
      Solder Shorts & How to Eliminate Them – In Selective & Wave Soldering @ Online Webinar
  6. Nov
    13
    Mon

    1. Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination @ Online Webinar
      2:30 pm – 3:30 pm

      All our webinars are based on UK time you can check the time in your location Click Here

      Bob Willis BGA bannerThis webinar includes all BGA (Ball Grid Array), BMC (Bottom Mounted Components), PoP (Package On Package) component assembly and process setup with inspection methods and common failure detection and elimination. Bob produced the first training videos, interactive CDs on area array technology and the first book on PoP assembly and soldering

      Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. A FREE copy of Bob’s Ebook on PoP is available to delegates and a copy of his area array posters is provided to each engineer attending this course

      For further information on sponsorship of this or other webinars to your customers contact Keith Bryant info@smartgroup.org

      To make your webinar booking Click Here

      If you have a specific process problems with reflow send it to Bob to include in the webinar

      Presented by Bob Willis

      Topics will include:

      Package types
      Design and PCB guide lines for parts
      Assembly process options
      Inspection standards & reliability
      Common process and reliability failures
      Defect Investigation techniques and corrective action

      A copy of the slides presented during the webinar are provided at the end of the event plus a link to a text book on PoP assembly and inspection wall charts for QFN inspection

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      2:30 pm
      Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination @ Online Webinar