−Making Ball Grid Array & Land Grid Array Rework Simpler to Perform – Webinar @ Online Webinar10:30 am – 12:00 pm
Ball Grid Array and all bottom termination components can bring challenges during rework and repair. Each component is part of mainstream assembly in both low and high volume manufacture. The parts are used in commercial and military products and need to be reliable after any rework process.
With this webinar we will introduce you to the best procedures and demonstrate many tricks of the trade. In a second part SMART Group will be running a hands on workshop in the UK to put theory into practice. Any delegate that attends the webinar will be entitled to a special discount on the practical session if they want to attend.
Presentation will be made by Jason O’Dell SMART Group Committee
Presentation will last between 60-90min
Topics to Include:
Removal processes for BGA and LGA package
Different methods for pad preparation
Dipping paste and printing paste to packages
Rework Stencils and requirements
Re-balling or pre-forms
Replacement of packages
Correct temperature profiling
Common failure modes
For further information or to make a booking Click Here+10:30 amMaking Ball Grid Array & Land Grid Array Rework Simpler to Perform – Webinar @ Online Webinar
−Seminar: Reliability and Standards in Real Life, an event with the IPC9:30 am – 4:00 pm
‘Breaking news, SMART group announce a bonus virtual speaker for their 11th September Reliability Seminar in conjunction with IPCDoug Pauls will be joining the seminar remotely to add his perspective as both an IPC Committee Chairman and a respected materials and process troubleshooting expert for Rockwell Collins.’
This one day seminar event is being held in the lecture theatre at the historic STEAM museum in Swindon and looks at how the use of international standards can increase the reliability and quality of Printed Circuit Board manufacturing and assembly processes and lead to reduced costs and increased profits.Speakers include:Lars Wallin – IPC European Representative
Karthik Vijay – Indium Corporation Europe, Technical Manager
Ashley Luxton- Graphic Plc. Applications Engineer
Sue Knight – STI Ltd and SMART Group Technical Committee Member
Nigel Burtt – Renishaw and SMART Group Technical Committee Member
-What quality and reliability problems can occur in Printed Circuit Board Assembly?
-A tour through the entire production chain of a PCBA to see which IPC Standards apply at each stage.
-Do standards guarantee quality? What if your requirements lie outside the sphere of normal standards?
-What are the benefits of using internationally recognised standards and the framework they provide for controlling your own manufacturing processes or for working with a subcontractor.
-How PCB suppliers and electronics manufacturing consumables use standards to guarantee the quality of the product they provide to downstream customers.
-How quality and continuous improvement can be driven by adherence to standards by making these a key part of the initial PCB and process design.
Who should attend?
This event is ideally suited to any member of staff working in electronics manufacturing and design. Managers will also benefit from a fuller understanding of the issues currently being experienced in our industry. The costs for delegates include drinks, lunch, and full access to all copies of the presentations immediately after the event. There will be an opportunity for delegates to explore the museum during the lunch break at no extra cost too.
For further information and a booking form Click here+9:30 amSeminar: Reliability and Standards in Real Life, an event with the IPC
−SMTA International 2014 with “Power and High Temperature Electronics Manufacturing Experience” @ Donald Stephens Convention Center10:00 am – 5:00 pm
This year in Rosemont, attendees and exhibitors can expect a focused event with the strongest technical conference for which SMTA International has come to be known. SMTAI has been recognized as a truly different type of industry event because of the high quality technical information and the networking opportunities that cannot be found anywhere else in the industry.
SMART Group have been a supporter of the SMTA for many years. This year Bob Willis and Chris Hunt are organising the “Power and High Temperature Electronics Manufacturing Experience” which aims to help engineers understand what is involved, what are the new materials and challenges plus the nuts and bolts assembly issues. for further information Click Here+10:00 amSMTA International 2014 with “Power and High Temperature Electronics Manufacturing Experience” @ Donald Stephens Convention Center
−Webinar: 3D AOI, exploding the myths and looking at new technology11:00 am – 2:30 pm
Advances in AOI Technology
14th October 2014 2.30 – 4.00pm UK Time
AOI Systems have changed dramatically in recent years. We have gone from very basic 2D image recognition to full 3D Systems and in between we have 2.5D, Pseudo 3D, side cameras, huge cameras, Line Scan and FOV. Keith will explain the strengths and weaknesses of these systems and give you a flavour for the full Seminar to be held on 4th December 2014 at the MTC .
Keith Bryant, SMART Group Chairman – AOI and X-Ray Technology Consultant
Who Should Attend?
Anyone looking to purchase or upgrade their AOI Equipment or anyone who would like a greater understanding of the subject.
This Webinar is free of charge.
Please contact Paula Muller, Business Manager, SMART Group on 02084322741 or 07504 231575 to reserve your space or email firstname.lastname@example.org.
Book a place for you or your engineering team today
SMART Group is also offering a range of smart-e-webinars to complement its existing interactive CD-ROM, Hands On and Theory training to companies in the electronics industry. SMART has always been innovative and keen to provide different types of education and support to the industry. smart-e-webinars are ideal learning opportunities for individuals or groups of engineers and will be presented by leading engineers in the electronics industry. Each session lasts between 60-90 min and allows a cost effective alternative to existing educational events without the hassle of travel. To participate in a smart-e-webinar all you need is a broadband internet connection, PC and headset microphone/headphones. Alternatively for groups in a conference room you use a PC with speakers, broadband connection and projector plus conference microphone.
To get the best out of your webinar experience read the following guide:+11:00 amWebinar: 3D AOI, exploding the myths and looking at new technology
−Good Practice in Design & Rework Considerations – Smart-e-link Webinar10:30 am – 11:30 am
The aim of the webinar is to provide participants with an understanding of the mechanisms of achieving reliable hand soldered joints in a consistent manner through the understanding of the soldering process, component and PCB requirements. Good design practice for modern printed boards will also be discussed with the impact it can have on the assembly and rework operation and the type of failures that can occur.
The topics addressed in this smart-e-webinar will include:
Adapt a ‘Right First Time’ Approach – Correct Tip Contact – Thermal Bridge
Minimise Heat Cycles
Solder Alloy Wetting Times and temperatures,
Soldering difficult thermal areas
Impact of more aggressive fluxes
Good PCB layout
Component position and pad to track interconnection
Impact of solder finish on soldering
Defects associated with poor design
Presented by Rob Mullane & Bob Willis the SMART Ireland Committee
SMART Group price is £65 plus VAT for members and £85 plus vat for non members
To reserve your place please contact Philip O’Rourke on +353 (0)1 8186321 or email email@example.com
Book a place for you or your engineering team today
To get the best out of your webinar experience read the following guide:+10:30 amGood Practice in Design & Rework Considerations – Smart-e-link Webinar
−J-STD-001 and IPC-A-610 – Updates to Conformal Coating section – An insider’s guide presented by Doug Pauls – Smart-e-link Webinar2:30 pm – 4:30 pm
J-STD-001 and IPC-A-610 – Updates to Conformal Coating section
An insider’s guide.
1st December 2014 2.30 – 4.00pm UK Time
The conformal coating provisions in J-STD-001 and IPC-A-610 have been need of improvement for a long time. With Revision F of both documents, the IPC conformal coating groups have reworked the requirements. This presentation goes over the new requirements and the underlying rationale for changes.
The baseline standard used by the electronics industry are under constant review, with the latest update of the standard amongst other changes the requirements for conformal coating are to be updated to reflect the latest technology and methods.
Following the up-issue of HDBK-830 in 2013 members of the same IPC committee have gone on to look at the corresponding provisions for conformal coating in the workmanship and inspection standards. Their recommendations are now ready for release.
The SMART group is pleased to be able to offer a ‘direct from the committee’ update on the changes that are being made.
Doug Pauls: Principal Materials and Process Engineer of Rockwell Collins and Chairman of the IPC Cleaning and Coating Committees, will provide a first hand technical guide as to the changes in his own inimitable style.
Topics will include:
- What changes are being made to J-STD 001 and IPC-A-610.
- What the rationale for the changes is.
Who Should Attend?
Anyone working in manufacture or design of high-reliability electronics or interested in understanding the requirements associated with their protection and coating needs.
SMART Group price is £65 plus VAT for members and £85 plus VAT for non members
Please contact Paula Muller, Business Manager, SMART Group on 02084322741 or 07504 231575 to reserve your space or email firstname.lastname@example.org. Payment can be made via BACS or credit/debit card
Book a place for you or your engineering team today
To get the best out of your webinar experience read the following guide:+2:30 pmJ-STD-001 and IPC-A-610 – Updates to Conformal Coating section – An insider’s guide presented by Doug Pauls – Smart-e-link Webinar
−Cleaning Printed Circuit Assemblies, Design, Evaluation & Process Control @ Enterprise Ireland9:30 am – 3:45 pm
Cleaning Printed Circuit Assemblies, Design, Evaluation & Process Control Workshop
12th February 2015 – Enterprise Ireland, East Point Dublin
Workshop starts at 10.00am with coffee and table top exhibition from 9:30 am. The event will conclude by 3.45pm
The majority of the industry worldwide have been running no clean processes for many years and have often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation and the demands of modern circuits cleaning has come back into fashion. Conformal coating is another process which has demanded special levels of surface cleanliness to guarantee coating adhesion and long term reliability. Although there are high reliability produces that use coating with no clean others want that extra confidence.
The workshop is sponsored by Enterprise Ireland and presented by Bob Willis.
PCB Design for cleaning
Testing component compatibility
Flux compatibility with cleaning solvents
Solubility of soldering residues
Cost of process chemistry and equipment
Inline or batch cleaning options
Who should attend?
This workshop is for process/quality engineers, supervisions and production staff involved with cleaning and contamination testing of printed board assemblies
For more information and a booking form Click here+9:30 amCleaning Printed Circuit Assemblies, Design, Evaluation & Process Control @ Enterprise Ireland
−“NPL & SMART Group Printing & Assembly Automatic Optical Inspection Experience” @ NEC, Birmingham9:30 am – 4:30 pm
Printing solder paste or other conductive material requires zero defects printing if a high first pass yield is to be achieved when using fine pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect? Correct printer set-up, good stencil design and manufacture plus consistent printing materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three dimensional inspection is required in other AOI applications.
This year’s special feature area at NEW will include printing ultra-fine pitch deposits, inspection and measurement of different combinations of materials plus some of the key in process inspection steps to make a process perform correctly. It will also include AOI inspection of assemblies for open joints, lifted leads, partial lifting of passives and other less common defects. For further information on NEW go to the web site Click Here
The feature will also include our popular mini seminars on related topics and the “NPL Defect Database Live” free process support on all of the your printing and the inspection defects.
Join the team early as we define the process, materials and how to make this production feature the best ever. Joining the team early benefits your company with increased exposure pre show.
Companies who could participate in the feature area and the seminars are listed below:
One PCB supplier
Prototype PCB system
Laser cut stencil machine supplier
Nano coating supplier for stencils
Stencil inspection AOI supplier
Solder paste suppliers
Stencil printer suppliers
Manual inspection supplier
Solder Paste Optical Inspection suppliers
Automatic Optical Inspection suppliers
Stencil cleaning supplier
Stencil cleaning materials
Introduction video for the feature can be seen Click Here
We will be holding a pre-show webinar on Thursday 9th April presented by Bob Willis, feature co-ordinator+9:30 am“NPL & SMART Group Printing & Assembly Automatic Optical Inspection Experience” @ NEC, Birmingham