SMART Group - Surface Mount and Related Technologies

Agenda

  1. Feb
    9
    Tue

    1. Advanced X-Ray Technology – Webinar
      2:30 pm – 4:00 pm

      XRay Webinar 2 Xray Webinar

      Advanced X-Ray Technology

      Tuesday, 9th February 2016, 14.30 – 16.00 UK Time

      This webinar will look at demanding applications for x-ray systems and how recent advances in technology allow them to meet these challenges

      Back end semiconductor applications are relatively new for x-ray systems, due to the minute and ever reducing feature size they represent the biggest challenge for the technology and systems able to cope with this are also future proof for PCBA inspection and Failure Analysis appications. This webinar will look at the capabilities of high end systems to inspect wafer bumps, copper pillars and TSV’s, as new designs are reducing key dimensions of all of these interconnections, challenging x-ray systems to produce clear images.

      SMART Group price is £65 plus VAT for members and £85.00 plus vat for non members

      Please contact Paula Muller, Business Manager, SMART Group on 02084322741 or 07504 231575 to reserve your space or email info@smartgroup.org.  Payment can be made via BACS or credit/debit card.

      Book a place for you or your engineering team today  

      SMART Group is also offering a range of smart-e-webinars to complement its existing interactive CD-ROM,

      Hands On and Theory training to companies in the electronics industry. SMART has always been innovative and keen to provide different types of education and support to the industry. smart-e-webinars are ideal learning opportunities for individuals or groups of engineers and will be presented by leading engineers in the electronics industry. Each session lasts between 60-90 min and allows a cost effective alternative to existing educational events without the hassle of travel. To participate in a smart-e-webinar all you need is a broadband internet connection, PC and headset microphone/headphones. Alternatively for groups in a conference room you use a PC with speakers, broadband connection and projector plus conference Microphone

      To get the best out of your webinar experience read the following guide:

      http://www.smartgroup.org/images/stories/howwebinarwork.pdf smart-e-webinar booking form

      Our web based seminars represent an efficient way to develop practical knowledge, delivering expert advice and guidance to you without leaving your workplace. Simple webinars offer a low cost and time efficient training option. They can be accessed from the internet, eliminating the need to take time out of the office and avoid expensive travel costs.

      Book a meeting room with computer and data projector at your facility and invite your colleagues to join you for a single fee from £65 per session.

      Technical seminars last 60-90mins with the opportunity to ask questions during or at the end of the session. The events are scheduled on different manufacturing topics of interest to engineers and production staff working in printed circuit board assembly.

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      2:30 pm
      Advanced X-Ray Technology – Webinar
  2. Feb
    17
    Wed

    1. Package On Package Design, Assembly, Inspection & Common Failures smart-e-webinar @ Online Webinar
      2:30 pm – 4:00 pm

      Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing

      popbanner
      Bob Willis the presenter is the author of the guide to POP Assembly, the first text book on POP and three other training aims on POP design and assembly

      The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar

      Presented by Bob Willis

      Topics covered:

      What is Package on Package (PoP)?
      Component standards
      PCB design rules
      Application of tack flux or dip paste
      Optical and X-ray inspection
      Rework and repair
      Question and answer session

      Cost: €90 (Euro) Member €125 (Euro) Non Member

      Please contact Philip O’Rourke of SMART Group Ireland on +353(0)86 806 1998 to reserve your space or email admin@smartgroupireland.com

      Payment can be made via credit/debit card or by Direct payment to SMART Group Ireland’s Bank Account

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      2:30 pm
      Package On Package Design, Assembly, Inspection & Common Failures smart-e-webinar @ Online Webinar
  3. Mar
    9
    Wed

    1. “High reliability in Modern Day Electronics Workshop” – SMART Group Ireland (all-day) @ Henkel Dublin
      Mar 9

      SMT Challenges of Automotive Electronics Miniaturisation

      The increase of electronics in automotive applications has led to a continuing trend towards miniaturisation of the hardware. Valeo Detection Vision Systems, based in Tuam, Co. Galway is at the forefront of advanced electronics manufacturing of highly populated double sided SMT designs with fine pitch solder paste printing, Intrusive Reflow, Chip Scale Packages. This presentation reviews the challenges on SMT to manufacture and verify high quality and reliable miniaturised electronics for the automotive environment.

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      “High reliability in Modern Day Electronics Workshop” – SMART Group Ireland @ Henkel Dublin (all-day)
  4. Mar
    15
    Tue

    1. Selective Soldering, Design, Process Challenges & Practical Solutions – Webinar – Free of Charge @ On Line Webinar
      2:30 pm – 4:00 pm

      Selective Soldering, Design, Process Challenges & Practical Solutions

      selective02Webinar Introduction:

      For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products.  So what is the most reliable and cost effective solution to through hole soldering in a tin/lead and lead-free environment?  Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities.

      In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures.

      During the session there will be a short time spent on alternative selective soldering processes like robotic point and laser soldering for high and low temperature soldering and the use of low temperature solders for surface mount and through hole parts

      selective01Who should attend?

      Process engineers tasked with process introduction, quality staff, and supervisors wanting to understand the process issues with lead-free selective soldering. Design engineers will benefit from a better understanding of the process they are designing circuit boards to pass through. The session may also benefit material, equipment suppliers to have a better understand of all the issues and interactions with new alloys and modern printed circuit design.

      This session will cover:

      Why use selective soldering

      User experience of selective wave point soldering with lead-free

      PCB design rules for selective soldering

      Changes to pad and interlayer connection pads to increase solder fill

      Flux requirements for selective soldering

      Compatibility of solder masks and lead-free solder

      Setting up tin/lead & lead-free profiles, you must profile a selective process!!!

      Solder alloy choices and copper dissolution reduction

      Inspection criteria for selective and impact on reliability

      Through hole joint strength & long term reliability

      Copper dissolution with selective and how to avoid it

      Soldering defects on selective – Most Common Causes & Cures

      Dendrite growth – Solder balling – Copper pad removal – Poor penetration – Copper saturation – Copper needles – Iron needle shorts

       

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      2:30 pm
      Selective Soldering, Design, Process Challenges & Practical Solutions – Webinar – Free of Charge @ On Line Webinar
  5. Mar
    22
    Tue

    1. Industry 4.0 is Coming! – Seminar (all-day) @ Electronics Yorkshire
      Mar 22

      There has been a lot of talk about Industry 4.0 and know it’s time for action!  The trends, such as big data, mass customisation and cyber physical systems, that have driven us to this point are becoming increasingly important and as more OEMs look to be Industry 4.0 ready in their supply chain.  It’s essential that manufacturers and suppliers understand what it all means and what it can offer them as well as their customers and the consumer.

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      Industry 4.0 is Coming! – Seminar @ Electronics Yorkshire (all-day)
    2. Area Array, Bottom Termination & Fine Pitch Rework & Repair Failures – Causes & Cures 2016 Webinar @ Online Webinar
      2:30 pm – 4:00 pm

      reworkbanner01

      The webinar will be held on Tuesday 22nd March at 2.30pm To register for the webinar Click Here

      For the first time you have the opportunity to experience all the most demanding rework challenges in the industry in one special exhibition feature. You can participate or watch experts rework boards featuring area array, fine pitch, underfill and conformally coated boards and ask their advice on your own repair challenge. After which you can inspect the results optically or with x-ray

      But before all that you can see and hear all about “Area Array Fine Pitch Rework & Repair Failures – Causes & Cures” with our special FREE pre show webinar Prior to the show we will be holding this special event which will be free to attend. The webinar will cover all aspects of rework and repair and the reasons for onsite or field failures. In addition it will introduce the rework challenge and the show feature activity
      reworkbanner03The webinar topics will include:

      Reliability testing of reworked products
      Impact of re-balling or re-terminating components
      Baking boards prior to rework
      Component and product failure modes
      Best practice procedures for reworking
      Failure modes in rework on site and in the field

      The webinar will be held on Tuesday 22nd March at 2.30pm To register for the webinar Click Here
      reworkbanner03

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      2:30 pm
      Area Array, Bottom Termination & Fine Pitch Rework & Repair Failures – Causes & Cures 2016 Webinar @ Online Webinar
  6. Apr
    12
    Tue

    1. Area Array, Bottom Termination & Fine Pitch Rework Experience (all-day) @ NEC, Birmingham
      Apr 12 – Apr 14

      Supported by NPL (National Physical Laboratory) & SMART Group
      reworkbanner03
      For the first time you have the opportunity to experience all the most demanding rework challenges in the industry in one exhibition feature. You can watch experts rework boards featuring area array, fine pitch, underfill and conformally coated boards and ask their advice on your own repair challenge. “Our latest Experience feature area will provide procedures and practical hands support for your biggest challenges in a real live environment plus the opportunity to win IPC standards and guidance documents organised by Bob Willis “We have been organising special features areas for many years but at National Electronics Week this is the first based on rework, repair, optical and x-ray Inspection. Meet many of the SMART Group Team at NEW 2016

      reworkbanner01
      Special attractions in our latest Experience feature area include:

      Chance to participate in one of the world’s first rework competition and raise your company profile
      Win IPC standards and training materials on rework
      Step by step presentations on rework process
      Meet world class training providers
      Solve your component and PCB failures
      Exchange ideas, solutions and rework tricks of the trade

      National Physical Laboratory (NPL) Defect Database Live

      Our feature will also include “NPL Defect Database Live” where you can get free process support on component and PCB defects and field failures. You can send images of your defects before the show or bring boards for discussion with our team of experts. Get free advice and consultancy all show long. Send your defect images in advance to Bob Willis bob@bobwillis.co.uk

      Pre Show Experience Webinar

      Area Array, Bottom Termination & Fine Pitch Rework & Repair Failures – Causes & Cures 2016

      Prior to the exhibition we will be holding a pre-event webinar which will be free to attend. The webinar will cover all aspects of rework and repair and the reasons for onsite or field failures. In addition, it will introduce the rework challenge and how staff can participate plus our show feature activity

      The webinar will be held on Tuesday 22nd March at 2.30pm
      To register for the webinar Click Here

      reworkbanner02Hands on Rework Challenge Competition

      Participants in the rework challenge competition will have to assemble area array devices and fine pitch packages and the remove the packages from the board. Participants will see information on the board type and components in advance. They can bring their own small hand tools if they wish. The boards will be examined by a third party IPC Master Instructor and will be designed to allow inspection or electrical test during the Experience feature. There will be special prizes for the winners

      In addition, visitors may have the opportunity to remove and replace some areas of conformal coating, component underfill then inspect the boards and joints to IPC standards

      Call for Supplier Company Participation

      Companies that we would like to get involved in the Experience:

      IR rework equipment
      Convection rework equipment
      Conformal coating rework station
      One optical area array inspection system
      One X-Ray supplier
      One PCB supplier
      Component suppliers
      IPC Training providers
      Component/PCB MSD storage
      Rework stencil suppliers
      Conformal coating suppliers
      Solder paste/flux suppliers
      Solder spheres for BGA rework
      Re-balling process and equipment
      Stencil printer suppliers
      Ultra sound inspection
      Manual Cleaning equipment supplier
      Cleaning materials
      Hand tools and extraction systems

      If you would like to support the feature with materials and equipment contact:  Claire Saunders   claire@new-expo.co.uk

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      Area Array, Bottom Termination & Fine Pitch Rework Experience @ NEC, Birmingham (all-day)
  7. Apr
    19
    Tue

    1. Selective Soldering, Design, Process Challenges & Practical Solutions – Workshop (all-day) @ Anglo Production Processes
      Apr 19

      Selective Soldering, Design, Process Challenges & Practical Solutions

      selective02Workshop Introduction:

      For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products.  So what is the most reliable and cost effective solution to through hole soldering in a tin/lead and lead-free environment?  Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities.

      In this workshop the instructors will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Inspection Wall Charts covering soldering of lead-free terminations and common defects found in manufacture.

      During the session there will be a short time spent on alternative selective soldering processes like robotic point and laser soldering for high and low temperature soldering and the use of low temperature solders for surface mount and through hole parts

      selective01Who should attend?

      Process engineers tasked with process introduction, quality staff, and supervisors wanting to understand the process issues with lead-free selective soldering. Design engineers will benefit from a better understanding of the process they are designing circuit boards to pass through. The session may also benefit material, equipment suppliers to have a better understand of all the issues and interactions with new alloys and modern printed circuit design.

      This session will cover:

      Why use selective soldering

      User experience of selective wave point soldering with lead-free

      PCB design rules for selective soldering

      Changes to pad and interlayer connection pads to increase solder fill

      Flux requirements for selective soldering

      Compatibility of solder masks and lead-free solder

      Setting up tin/lead & lead-free profiles, you must profile a selective process!!!

      Solder alloy choices and copper dissolution reduction

      Inspection criteria for selective and impact on reliability

      Through hole joint strength & long term reliability

      Copper dissolution with selective and how to avoid it

      Soldering defects on selective – Most Common Causes & Cures

      Dendrite growth – Solder balling – Copper pad removal – Poor penetration – Copper saturation – Copper needles – Iron needle shorts

       

      +
      Selective Soldering, Design, Process Challenges & Practical Solutions – Workshop @ Anglo Production Processes (all-day)
  8. May
    18
    Wed

    1. “Design For Advanced Manufacturing, Failure Analysis incorporating 3D workshop” – SMART Group Ireland (all-day) @ SEAM Facility Waterford IT
      May 18

      This workshop will look at the latest tools available for design for advanced manufacturing, with an in depth look at failure analysis and ways to improve your products. This unique workshop will also look at the latest tools available in terms of 3D printing. Papers and studies  will be presented by the SEAM Group (South Eastern Applied Materials Research Centre) at Waterford IT together with Tyndall National Institute, Cork.

      Facility Tour included with the workshop.

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      “Design For Advanced Manufacturing, Failure Analysis incorporating 3D workshop” – SMART Group Ireland @ SEAM Facility Waterford IT (all-day)
  9. Jun
    30
    Thu

    1. Area Array Design & Assembly including Underfill & Corner Bonding for Increased Reliability smart-e-webinar @ Online Webinar
      2:30 pm – 4:00 pm

      Ball Grid Array packages have been used in the industry for many years. Just like surface mount, the use of BGA’s can affect printed board layout, assembly, inspection and repair process. BGA’s do however provide significant advantages over fine pitch components particularly in terms of process assembly yield. Correct design, printing and profiling is necessary to obtain the highest yields and reliably interconnection. To increase robustness and long term reliability underfill and corner bumping with adhesives have become popular and is also a design consideration
      BGAbannerEveryone blames the BGA if failure occurs often because you can’t see under the package but is it the real failure mode. Bob produced the first video tape and interactive CD-ROM on BGA technology, practical advice is what you get on any of Bobs’ sessions supported by unique video clips to make the session come alive. All staff involved in the process of area array soldering with tin/lead and lead-free BGA assembly processes; including procurement, design engineers, reliability, quality personnel, failure analysts, and management involving is setting standards, inspection and product assessment of boards containing BGA, CSP, LGA and other area array components

      The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar

      Topics include:

      Design rules
      Printed board layout
      Underfill and corner bumping benefits
      Surface finish selection
      Inspection/assembly marks
      Assembly process
      Rework procedures
      BGA failures, Package cracking, Solder balls, Misalignment, Non reflow
      Inspection criteria

      Cost: €90 (Euro) Member €125 (Euro) Non Member

      Please contact Philip O’Rourke of SMART Group Ireland on +353(0)86 806 1998 to reserve your space or email admin@smartgroupireland.com

      Payment can be made via credit/debit card or by Direct payment to SMART Group Ireland’s Bank Account

      +
      2:30 pm
      Area Array Design & Assembly including Underfill & Corner Bonding for Increased Reliability smart-e-webinar @ Online Webinar