SMART Group - Surface Mount and Related Technologies

Agenda

  1. Jun
    30
    Thu

    1. Area Array Design & Assembly including Underfill & Corner Bonding for Increased Reliability smart-e-webinar @ Online Webinar
      2:30 pm – 4:00 pm

      Ball Grid Array packages have been used in the industry for many years. Just like surface mount, the use of BGA’s can affect printed board layout, assembly, inspection and repair process. BGA’s do however provide significant advantages over fine pitch components particularly in terms of process assembly yield. Correct design, printing and profiling is necessary to obtain the highest yields and reliably interconnection. To increase robustness and long term reliability underfill and corner bumping with adhesives have become popular and is also a design consideration
      BGAbannerEveryone blames the BGA if failure occurs often because you can’t see under the package but is it the real failure mode. Bob produced the first video tape and interactive CD-ROM on BGA technology, practical advice is what you get on any of Bobs’ sessions supported by unique video clips to make the session come alive. All staff involved in the process of area array soldering with tin/lead and lead-free BGA assembly processes; including procurement, design engineers, reliability, quality personnel, failure analysts, and management involving is setting standards, inspection and product assessment of boards containing BGA, CSP, LGA and other area array components

      The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar

      Topics include:

      Design rules
      Printed board layout
      Underfill and corner bumping benefits
      Surface finish selection
      Inspection/assembly marks
      Assembly process
      Rework procedures
      BGA failures, Package cracking, Solder balls, Misalignment, Non reflow
      Inspection criteria

      Cost: €90 (Euro) Member €125 (Euro) Non Member

      Please contact Philip O’Rourke of SMART Group Ireland on +353(0)86 806 1998 to reserve your space or email admin@smartgroupireland.com

      Payment can be made via credit/debit card or by Direct payment to SMART Group Ireland’s Bank Account

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      2:30 pm
      Area Array Design & Assembly including Underfill & Corner Bonding for Increased Reliability smart-e-webinar @ Online Webinar
  2. Sep
    14
    Wed

    1. “Developments in Advanced HDI Technology & Embedded Systems workshop” – SMART Group Ireland (all-day) @ Tyndall, Cork
      Sep 14

      This workshop will look at the latest developments in Advanced High Density Interconnect. A HDI PCB is defined as a PCB with a higher wiring density per unit area than conventional PCB. They have finer lines and spaces, smaller vias and capture pads and higher connection pad density than employed in conventional PCB technology. A HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing. The workshop will also look at embedded systems is a computer system with a dedicated function within a larger mechanical or electrical system, often with real-time computing constraints.  It is embedded as part of a complete device often including hardware and mechanical parts. Embedded systems control many devices in common use today. 98 percent of all microprocessors being manufactured are used in embedded systems

      Papers and studies  will be presented by EMC, Cork, together with Tyndall National Institute, Cork.

      Facility Tour included with the workshop.

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      “Developments in Advanced HDI Technology & Embedded Systems workshop” – SMART Group Ireland @ Tyndall, Cork (all-day)
  3. Oct
    13
    Thu

    1. LED Design Assembly and Soldering Process Issues Causes & Cures smart-e-webinar @ Online Webinar
      2:30 pm – 4:00 pm

      LEDs Light Emitting Diodes are common in today’s industry, but now with the growing use of larger boards and more demanding devices there are challenges to each step in the assembly process. There are many different types of LED and limited interchangeability with parts from different suppliers

      The components can be sensitive to moisture and contamination on the surface of the parts impacting performance. During the webinar Bob Willis will explain many of the process issues faced and how to overcome them in manufacture
      LEDBannerWebinar topics include:

      LED design requirements
      Metal/epoxy PCB substrates
      Component specification requirements
      Changes to printing, placement and reflow
      Soldering material considerations
      LED failure modes
      Inspection requirements

      Presented by Bob Willis

      The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar

      Cost: €90 (Euro) Member €125 (Euro) Non Member

      Please contact Philip O’Rourke of SMART Group Ireland on +353(0)86 806 1998 to reserve your space or email admin@smartgroupireland.com

      Payment can be made via credit/debit card or by Direct payment to SMART Group Ireland’s Bank Account

      +
      2:30 pm
      LED Design Assembly and Soldering Process Issues Causes & Cures smart-e-webinar @ Online Webinar