SMART Group - Surface Mount and Related Technologies

Agenda

  1. Aug
    14
    Mon

    1. Solderability Benchmarking, Failures & Testing Methods @ Online Webinar
      2:30 pm – 4:00 pm

      All our webinars are based on UK time you can check the time in your location Click Here

      solderabilitybannerBenchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratory. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry. Understanding how to conduct simple shop floor assessment of components or using laboratory test methods will be discussed along with artificially age coatings to simulate their useful life. Solderability can impact yield and reliability and making sure engineers understand the test methods onsite, or when subcontracting you’re testing to a laboratory, is key to ascertaining the correct root cause of your process problem.

      The webinar will last approximately 60-90mins including a question and answer session for your process problems. If you have a specific process problems and you will be a delegate on the solderability session send it to SMART to include in the webinar defects

      To get further details and a booking form Click Here

      Presented by Bob Willis

      Topics covered:

      Test specifications
      Test methods
      Selecting the best procedure
      Ageing samples
      Assessment of results
      Solderability failures

      The webinar material includes slides from the event, solderability testing wall charts and design files for solderability test board to use in your factory

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      2:30 pm
      Solderability Benchmarking, Failures & Testing Methods @ Online Webinar
  2. Sep
    11
    Mon

    1. PCB Outgassing & How to Test Bare or Assembled Boards @ Online Webinar
      2:30 pm – 3:30 pm

      All our webinars are based on UK time you can check the time in your location Click Here

      Bob Willis gassing bannerPrinted circuit boards outgas during soldering causing solder voids, solder balls and other process problems. Outgassing can occur in wave, selective and reflow soldering and it’s important first to non-destructively test samples to find the root cause. It’s possible to test bare or assembled boards to examine the potential for failure and eliminate some of the popular misconception in industry. There some different methods which can easily be conducted in manufacture before proceeding to costly laboratory analysis and we show you how to do it and the typical results you can find!!

      The webinar will last approximately 60-90mins including question and answer session

      Presented by Bob Willis

      Topics covered:

      Type of outgassing from vias, through holes and solder masks
      How to Test samples in manufacture
      Test method procedures
      Type of defects and how they can appear with tin/lead and lead-free alloys
      Void formation in wave selective and PIHR joints
      Correct specification of your boards

      A copy of the slides presented during the webinar are provided at the end of the event along with a written procedure for testing

      For further information on sponsorship of this or other webinars to your customers contact Keith Bryant info@smartgroup.org

      To make your webinar booking Click Here

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      2:30 pm
      PCB Outgassing & How to Test Bare or Assembled Boards @ Online Webinar
  3. Sep
    14
    Thu

    1. QFN/LGA & Bottom Mounted Termination Process Defects – Causes & Cures @ Henkel
      9:30 am – 4:00 pm

      QFN/LGA & Bottom Mounted Termination Process Defects – Causes & Cures
      Thursday 14th September starting at 9.30am, coffee at 9.00am and finishing at 4.00pm

      qfnbanner1
      Table Top Exhibition space will be limited at this event, book you place early to avoid disappointment Click Here

      The workshop will consider design, process and materials to reduce or eliminate common issues seen on QFN/LGA & Bottom Mounted Termination Components. These packages are being used in the most demanding environments and their use will increase with larger packages and increasing process issues

      qfnbanner2

      Defect issues being addressed in the workshop will include:

      Solder joint reliability improvements
      Successful cleaning under parts
      Void formation and elimination
      Reliability issue with conformal coating
      Improvements in side solder fillet formation

      We will be arranging some hands-on soldering demonstrations with QFN/LGA & Bottom Mounted Components to best illustrate improvements in soldering yields. The SMART Group event is ideal for design, process and quality engineers. It will also benefit component and PCB suppliers
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      Each delegate will receive a copy of all the slides presented plus a set of SMART Group QFN/LGA & Bottom Mounted Termination Process Defects & Inspection Posters

      To book your workshop place or for further information Click Here

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      9:30 am
      QFN/LGA & Bottom Mounted Termination Process Defects – Causes & Cures @ Henkel
  4. Oct
    17
    Tue

    1. Solder Shorts & How to Eliminate Them – In Selective & Wave Soldering @ Online Webinar
      2:30 pm – 3:30 pm

      All our webinars are based on UK time you can check the time in your location Click Here

      soldershortbanner2Solder short and unsoldered joints are fundamental defects in manufacture and can occur due to design, process change, change in materials or poor process set-up. Some fundamental choices in the methods of assembly and soldering process will increase solder shorts and this session will look at the causes and cures of the solder short

      For further information on sponsorship of this or other webinars to your customers contact Keith Bryant info@smartgroup.org

      To make your webinar booking Click Here

      During the session, your presenter will show many causes of solder shorts forming and different solutions to the problem, both process and design tricks of the trade. Process tricks are particularly useful to the contract assembler finding it difficult to get design changes pasted customers. However, many changes in design are very simple, quick and will have no impact on function, reliability or product operation. Some suggestion allows for greater design density and reduce the possibility of product failure

      Presented by Bob Willis who spent many years running the Electrovert Wave Soldering Master Class, both one and two-day theory and hands on training in Europe. Bob still runs his own courses on selective and wave soldering for customers worldwide

      Each webinar last approximately 60-90 mins with the opportunity for questions on you process issues. Registered delegates on the webinar can send their own problem images for discussion during the webinar

      Topics covered include:

      Selective & wave soldering process
      Flux activity & De-Activation
      Solder drainage & cooling rates
      Wetting speed
      Design & layout
      Solder shorts
      Solder flags
      Solder whisker
      Impact of solder pallet design
      Process optimisation

      A copy of the slides presented during the webinar are provided at the end of the event

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      2:30 pm
      Solder Shorts & How to Eliminate Them – In Selective & Wave Soldering @ Online Webinar
  5. Nov
    9
    Thu

    1. SMART/NPL Process, Design & Reliability Seminar @ NPL, Teddington
      9:30 am – 4:00 pm

      SMART/NPL Process, Design & Reliability Seminar
      Thursday 9th November starting at 9.30am, coffee at 9.00am and finishing at 4.00pm

      HTPCBbanner2
      Table Top Exhibition space will be limited at this event, book you place early to avoid disappointment Click Here

      This seminar will showcase the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, high temperature reliability for alternative solders and substrates materials
      SIRCondensationbanner1

      In addition, one of the presentations will focus on the best methods to evaluate solder joint reliability, how to test and what to expect in terms of failure with different test methods. Delegates will be provided with a full list of the NPL Project Report Database and can select documents for FREE download

      Each delegate will receive a copy of all the slides presented, two HT Project Reports plus a set of SMART Group High Temperature Soldering & Defect Guide Posters

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      9:30 am
      SMART/NPL Process, Design & Reliability Seminar @ NPL, Teddington
  6. Nov
    13
    Mon

    1. Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination @ Online Webinar
      2:30 pm – 3:30 pm

      All our webinars are based on UK time you can check the time in your location Click Here

      Bob Willis BGA bannerThis webinar includes all BGA (Ball Grid Array), BMC (Bottom Mounted Components), PoP (Package On Package) component assembly and process setup with inspection methods and common failure detection and elimination. Bob produced the first training videos, interactive CDs on area array technology and the first book on PoP assembly and soldering

      Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. A FREE copy of Bob’s Ebook on PoP is available to delegates and a copy of his area array posters is provided to each engineer attending this course

      For further information on sponsorship of this or other webinars to your customers contact Keith Bryant info@smartgroup.org

      To make your webinar booking Click Here

      If you have a specific process problems with reflow send it to Bob to include in the webinar

      Presented by Bob Willis

      Topics will include:

      Package types
      Design and PCB guide lines for parts
      Assembly process options
      Inspection standards & reliability
      Common process and reliability failures
      Defect Investigation techniques and corrective action

      A copy of the slides presented during the webinar are provided at the end of the event plus a link to a text book on PoP assembly and inspection wall charts for QFN inspection

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      2:30 pm
      Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination @ Online Webinar
  7. Nov
    21
    Tue

    1. BGA, QFN Fine Pitch Rework Experience Live @ Henkel Hemel Hempstead
      9:30 am – 4:00 pm

      BGA, QFN Fine Pitch Rework Experience Live
      Tuesday 21st November starting at 9.30am, coffee at 9.00am and finishing at 4.00pm

      reworkbanner02
      Test your skills on different area array rework systems with QFN and BGA packages. Our test board was recently featured in the IPC, NPL & SMART Group Rework Experience and you can see your own results under x-ray inspection. During the session delegates can rework one of the Rework Experience Test Boards and have demonstrations of different methods of reworking packages with solder paste print, dip paste and gel paste and see the benefits of different techniques. Each delegate will receive a SMART Group Certificate of attendance

      Table Top Exhibition space will be limited at this event, book you place early to avoid disappointment Click Here

      reworkbanner01

      It’s quite a few years since SMART Group held one of its popular rework workshops so here is a chance to try out new rework stencils produced with polyimide, latest dip paste products. We hope to feature a range of different convection and IR rework systems with semi and fully automated software and the latest solder removal methods

      Each delegate will receive a copy of all the slides presented plus a set of SMART Group Rework and Repair Poster Sets

      reworkbanner03
      To book your workshop place or for further information Click Here

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      9:30 am
      BGA, QFN Fine Pitch Rework Experience Live @ Henkel Hemel Hempstead
  8. Apr
    24
    Tue

    1. Electronics in Harsh Environments – European Conference
      9:30 am – 5:00 pm

      Following on from a very successful first conference the dates and theme of the second annual event have been announced. April 24 – 26 Amsterdam, Netherlands with more details to follow soon

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      9:30 am
      Electronics in Harsh Environments – European Conference