−Storage and handling Components – Smart-e-Webinar2:30 pm – 4:00 pm
Storage and Handling Components
Thursday 29th January 2014, 14.30 – 16.00 UK Time
As components and the pitch of devices become smaller, the complexity and power consumption of PCBs and devices become ever greater the risk of damage from moisture absorption increases. As the fluxes in the solder you use become more environmentally stable water from the atmosphere or pcb / components can effect the stability or soldering efficiency of the product leading to an increase in defects.
During soldering moisture turns to water vapour and can generate considerable internal stress which may lead to premature failure. In the case Quad Flat Packs (QFPs) and Plastic Ball Grid Arrays (PBGAs) the resulting defect is often referred to as “popcorning” due to the sound of steam escaping from the package. When printed circuit boards outgas you see minor soldering faults, full delamination, blistering of the board or very subtle via hole failure. Also poor wetting and random solder balling in the solder
Considerable research into the correct procedures to minimize problems with bare boards and components has culminated in IPC standards to help guide engineers to reduce the possibility of failure. Solder suppliers are investing large amounts in research to try to negate the effect of water absorption on their products. The SMART Group have put together a webinar looking at each of the issues associated with the prevention of failure, correct onsite operating procedures and the equipment than can be used to store products and eliminate failures of this type
SMART Group price is £65 plus VAT for members and £85.00 plus vat for non members
Please contact Paula Muller, Business Manager, SMART Group on 02084322741 or 07504 231575 to reserve your space or email email@example.com. Payment can be made via BACS or credit/debit card.
Book a place for you or your engineering team today
SMART Group is also offering a range of smart-e-webinars to complement its existing interactive CD-ROM,
Hands On and Theory training to companies in the electronics industry. SMART has always been innovative and keen to provide different types of education and support to the industry. smart-e-webinars are ideal learning opportunities for individuals or groups of engineers and will be presented by leading engineers in the electronics industry. Each session lasts between 60-90 min and allows a cost effective alternative to existing educational events without the hassle of travel. To participate in a smart-e-webinar all you need is a broadband internet connection, PC and headset microphone/headphones. Alternatively for groups in a conference room you use a PC with speakers, broadband connection and projector plus conference Microphone
To get the best out of your webinar experience read the following guide:
http://www.smartgroup.org/images/stories/howwebinarwork.pdf smart-e-webinar booking form
Our web based seminars represent an efficient way to develop practical knowledge, delivering expert advice and guidance to you without leaving your workplace. Simple webinars offer a low cost and time efficient training option. They can be accessed from the internet, eliminating the need to take time out of the office and avoid expensive travel costs.
Book a meeting room with computer and data projector at your facility and invite your colleagues to join you for a single fee from £65 per session.
Technical seminars last 60-90mins with the opportunity to ask questions during or at the end of the session. The events are scheduled on different manufacturing topics of interest to engineers and production staff working in printed circuit board assembly.+2:30 pmStorage and handling Components – Smart-e-Webinar
−Lower Silver Pb Free alloys – Smart-e-Webinar2:30 pm – 4:00 pm+2:30 pmLower Silver Pb Free alloys – Smart-e-Webinar
−Cleaning Printed Circuit Assemblies, Design, Evaluation & Process Control @ Enterprise Ireland8:30 am – 2:45 pm
Cleaning Printed Circuit Assemblies, Design, Evaluation & Process Control Workshop
12th February 2015 – Enterprise Ireland, East Point Dublin
Workshop starts at 10.00am with coffee and table top exhibition from 9:30 am. The event will conclude by 3.45pm
The majority of the industry worldwide have been running no clean processes for many years and have often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation and the demands of modern circuits cleaning has come back into fashion. Conformal coating is another process which has demanded special levels of surface cleanliness to guarantee coating adhesion and long term reliability. Although there are high reliability produces that use coating with no clean others want that extra confidence.
The workshop is sponsored by Enterprise Ireland and presented by Bob Willis.
PCB Design for cleaning
Testing component compatibility
Flux compatibility with cleaning solvents
Solubility of soldering residues
Cost of process chemistry and equipment
Inline or batch cleaning options
Who should attend?
This workshop is for process/quality engineers, supervisions and production staff involved with cleaning and contamination testing of printed board assemblies
For more information and a booking form Click here+8:30 amCleaning Printed Circuit Assemblies, Design, Evaluation & Process Control @ Enterprise Ireland
−Storage and Handling Components – Seminar @ To be Confirmed9:15 am – 4:00 pm+9:15 amStorage and Handling Components – Seminar @ To be Confirmed
−Printing vs Jet Printing – Smart-e-Webinar2:30 pm – 4:00 pm+2:30 pmPrinting vs Jet Printing – Smart-e-Webinar
−The Printing & Assembly Automatic Optical Inspection Experience FREE online Webinar2:30 pm – 4:00 pm
Register free at https://www1.gotomeeting.com/register/157291057
The Printing & Assembly Automatic Optical Inspection Experience FREE Online Webinar 2.30pm Thursday 9th April
Printing solder paste or other conductive material requires zero defects printing if a high first pass yield is to be achieved when using fine pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect? Correct printer set-up, good stencil design and manufacture plus consistent printing materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three dimensional inspections is required in other AOI applications like solder joint analysis
This is a pre-show webinar prior to the Hands On NPL & SMART Group Experience at NEW Exhibition, NEC in Birmingham 21-22nd April
Topics covered in the webinar:
Solder paste inspection standards
Soldering yield impact with poor printing Impact on reliability based on paste thickness Solder joint inspection for AOI Assessment of AOI and SPI Common process defects causes and cures+2:30 pmThe Printing & Assembly Automatic Optical Inspection Experience FREE online Webinar
−“NPL & SMART Group Printing & Assembly Automatic Optical Inspection Experience” @ NEC, Birmingham9:30 am – 4:30 pm
Printing solder paste or other conductive material requires zero defects printing if a high first pass yield is to be achieved when using fine pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect? Correct printer set-up, good stencil design and manufacture plus consistent printing materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three dimensional inspection is required in other AOI applications.
This year’s special feature area at NEW will include printing ultra-fine pitch deposits, inspection and measurement of different combinations of materials plus some of the key in process inspection steps to make a process perform correctly. It will also include AOI inspection of assemblies for open joints, lifted leads, partial lifting of passives and other less common defects. For further information on NEW go to the web site Click Here
The feature will also include our popular mini seminars on related topics and the “NPL Defect Database Live” free process support on all of the your printing and the inspection defects.
Join the team early as we define the process, materials and how to make this production feature the best ever. Joining the team early benefits your company with increased exposure pre show.
Companies who could participate in the feature area and the seminars are listed below:
One PCB supplier
Prototype PCB system
Laser cut stencil machine supplier
Nano coating supplier for stencils
Stencil inspection AOI supplier
Solder paste suppliers
Stencil printer suppliers
Manual inspection supplier
Solder Paste Optical Inspection suppliers
Automatic Optical Inspection suppliers
Stencil cleaning supplier
Stencil cleaning materials
Introduction video for the feature can be seen Click Here
We will be holding a pre-show webinar on Thursday 9th April presented by Bob Willis, feature co-ordinator+9:30 am“NPL & SMART Group Printing & Assembly Automatic Optical Inspection Experience” @ NEC, Birmingham
−Advances in Assembly Technology – Smart-e-Webinar2:30 pm – 4:00 pm+2:30 pmAdvances in Assembly Technology – Smart-e-Webinar
−Thermal Management – Smart-e-Webinar2:30 pm – 4:00 pm+2:30 pmThermal Management – Smart-e-Webinar
−Advances in Assembly Technology – Seminar @ To be Confirmed9:15 am – 4:00 pm+9:15 amAdvances in Assembly Technology – Seminar @ To be Confirmed