SMART Group - Surface Mount and Related Technologies

Agenda

  1. Sep
    14
    Wed

    1. “Developments in Advanced HDI Technology & Embedded Systems workshop” – SMART Group Ireland (all-day) @ Tyndall, Cork
      Sep 14

      This workshop will look at the latest developments in Advanced High Density Interconnect. A HDI PCB is defined as a PCB with a higher wiring density per unit area than conventional PCB. They have finer lines and spaces, smaller vias and capture pads and higher connection pad density than employed in conventional PCB technology. A HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing. The workshop will also look at embedded systems is a computer system with a dedicated function within a larger mechanical or electrical system, often with real-time computing constraints.  It is embedded as part of a complete device often including hardware and mechanical parts. Embedded systems control many devices in common use today. 98 percent of all microprocessors being manufactured are used in embedded systems

      Papers and studies  will be presented by EMC, Cork, together with Tyndall National Institute, Cork.

      Facility Tour included with the workshop.

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      “Developments in Advanced HDI Technology & Embedded Systems workshop” – SMART Group Ireland @ Tyndall, Cork (all-day)
  2. Oct
    11
    Tue

    1. Tin Whisker Mitigation Methodologies – smart-e-webinar @ Online smart-e-webinar
      2:30 pm – 4:00 pm

      Prior to our SMART Group seminar on 24th November we will be holding a free introductory smart-e- webinar on Tin Whiskers. This will provide an overview of the many topics covered in the full day seminar which include:
      tinwhiskers3A keynote presentation on the State of the Art concerning Tin Whiskers
      Evolution of Whisker Mitigation techniques from iNEMI in 2006 to present day IEC Standards
      Impact of Tin Plating methodologies on tin whisker formation
      Research into Mitigation using Conformal Coating by Loughborough University & National Physical Laboratory
      Whisker mitigation from an End Users Perspective
      Mitigation via component re-finishing

      Who Should Attend: 

      These events are ideally suited to any member of staff in electronics manufacturing or design who wish to improve their knowledge of the issues surrounding tin whiskers and current thinking concerning mitigation techniques. Managers and non-engineering support staff will also benefit from a fuller understanding of the issues involved.

       

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      2:30 pm
      Tin Whisker Mitigation Methodologies – smart-e-webinar @ Online smart-e-webinar
  3. Oct
    13
    Thu

    1. LED Design Assembly and Soldering Process Issues Causes & Cures smart-e-webinar @ Online Webinar
      2:30 pm – 4:00 pm

      LEDs Light Emitting Diodes are common in today’s industry, but now with the growing use of larger boards and more demanding devices there are challenges to each step in the assembly process. There are many different types of LED and limited interchangeability with parts from different suppliers

      The components can be sensitive to moisture and contamination on the surface of the parts impacting performance. During the webinar Bob Willis will explain many of the process issues faced and how to overcome them in manufacture
      LEDBannerWebinar topics include:

      Booking form for this event Click Here

      LED design requirements
      Metal/epoxy PCB substrates
      Component specification requirements
      Changes to printing, placement and reflow
      Soldering material considerations
      LED failure modes
      Inspection requirements

      Presented by Bob Willis

      The webinar will last approximately 90mins with question and answer session. A copy of the slides are provided directly after the webinar. Information on webinars, how to get the most out of a session and the requirements Click Here

      Cost: €90 (Euro) Member €125 (Euro) Non Member

      Booking form for this event Click Here

      Please contact Philip O’Rourke of SMART Group Ireland on +353(0)86 806 1998 to reserve your space or email admin@smartgroupireland.com

      Payment can be made via credit/debit card or by Direct payment to SMART Group Ireland’s Bank Account

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      2:30 pm
      LED Design Assembly and Soldering Process Issues Causes & Cures smart-e-webinar @ Online Webinar
  4. Nov
    24
    Thu

    1. Tin Whisker Mitigation Methodologies @ Loughborough University
      9:30 am – 4:00 pm
      Holywell Park, Loughborough UniversitySince the introduction of the RoHS legislation in 2006, the threat of tin whisker related short circuit failure from pure tin finished components has remained as a major concern within the high reliability electronics manufacturing industry. But how do we set about mitigating against such failure where the use of pure tin finished components is unavoidable?
      tinwhiskers2
      This seminar is aimed at answering this question, providing a series of technical presentations that will capture current thinking regarding whisker mitigation. As a taster to the seminar, there will be a FREE smart-e-webinar on 11th October 2016 that will give an overview of the subjects to be presented


      Seminar Topics will include: –
       

      A keynote presentation on the State of the Art concerning Tin Whiskers
      Evolution of Whisker Mitigation techniques from iNEMI in 2006 to present day IEC Standards
      Impact of Tin Plating methodologies on tin whisker formation
      Research into Mitigation using Conformal Coating by Loughborough University & National Physical Laboratory
      Whisker mitigation from an End Users Perspective
      Mitigation via component re-finishing

      Who Should Attend:
       

      These events are ideally suited to any member of staff in electronics manufacturing or design who wish to improve their knowledge of the issues surrounding tin whiskers and current thinking concerning mitigation techniques. Managers and non-engineering support staff will also benefit from a fuller understanding of the issues involved
      +
      9:30 am
      Tin Whisker Mitigation Methodologies @ Loughborough University