−Soldering Voids: Formation, Causes and Mitigation Workshop @ MTC, Coventry9:30 am – 4:00 pmTuesday 25th October 2016 – The Manufacturing Technology Centre (MTC)The Workshop will start at 10.00am with coffee and delegate registration from 9.30am and conclude around 4pmTo book you place email email@example.com or call Keith Bryant +44 (0)208 4322741 Mobile: +44 (0)7946 133531The workshop will include presentations from soldering consumable suppliers, inspection equipment suppliers and from Manufacturing Technology Centre staff working with SMART GroupTopics that will be covered during the workshop are:
What is a void? What agreed definitions can we use?
What are the root causes of voiding? What can we do to prevent these?
How good is your inspection equipment for void detection? What new techniques are available?
How does voiding impact the performance and reliability of your products?
What are the current international standards applicable to voiding?
For further information or to make a booking Click Here
Who should attend?This event is ideally suited to any member of staff working in electronics manufacturing and design. Managers will also benefit from a fuller understanding of the issues currently being experienced in our industry. The costs for delegates include tea and coffee, lunch and full access to copies of all the presentation material immediately after the event. There may also be an opportunity for delegates to have a tour of some of the MTC facilities if requested. To book you place email firstname.lastname@example.org or call Keith Bryant +44 (0)208 4322741 Mobile: +44 (0)7946 133531+9:30 amSoldering Voids: Formation, Causes and Mitigation Workshop @ MTC, Coventry
−Tin Whisker Mitigation Methodologies @ Loughborough University9:30 am – 4:00 pmHolywell Park, Loughborough University Since the introduction of the RoHS legislation in 2006, the threat of tin whisker related short circuit failure from pure tin finished components has remained as a major concern within the high reliability electronics manufacturing industry. But how do we set about mitigating against such failure where the use of pure tin finished components is unavoidable?
For further information and a booking form Click HereThis seminar is aimed at answering this question, providing a series of technical presentations that will capture current thinking regarding whisker mitigation. As a taster to the seminar, there will be a smart-e-webinar on 11th October 2016 that will give an overview of the subjects to be presented
Seminar Topics will include: –An Overview of Problems associated with Tin Whisker Growths and Management of Mitigation Processes
Dr Barrie Dunn
BD Consulting / University of PortsmouthTin Whisker Mitigation – Research into Mechanisms & Strategies
Part 1 – Effect of Plating Methodologies
Dr Mark Ashworth
Loughborough UniversityEvolution of Mitigation Methods via Technical Standards
MBDA Missile SystemsMitigation of Tin Whiskers on Printed Circuit Assemblies
National Physical LaboratoryPractical Aspects of Tin Whisker Mitigation
Rolls-Royce Controls and Data ServicesTin Whisker Mitigation – Research into Mechanisms & Strategies
Part 2 – Post-Plating Mitigation Methods
Dr Mark AshworthLoughborough UniversityHot Solder Dipping for Tin Whisker Mitigation
Who Should Attend:These events are ideally suited to any member of staff in electronics manufacturing or design who wish to improve their knowledge of the issues surrounding tin whiskers and current thinking concerning mitigation techniques. Managers and non-engineering support staff will also benefit from a fuller understanding of the issues involvedTo book your place at this event please complete the Booking FormIf you would like to book a Table Top Exhibition Space contact Keith Bryant+9:30 amTin Whisker Mitigation Methodologies @ Loughborough University